Optical lens, light emitting device, and lighting device having the same

ABSTRACT

The light emitting device includes a light emitting chip, and an optical lens provided over the light emitting chip. The optical lens includes an incident surface into which a light emitted from the light emitting chip is incident, a recess portion opposite to the incident surface and recessed in a direction of the incident surface, an exit surface provided at a peripheral portion of the recess portion to output a light incident through the incident surface, and a convex portion protruding between the recess portion and the exit surface and connected with at least one of the recess portion and the exit surface through an inflection point. The convex portion is located inward of a line segment ranging from the light emitting chip to a first inflection point provided at an outermost portion of the recess portion.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims priority under 35 U.S.C. §119(a) ofKorean Patent Application No. 10-2012-0095895 filed on Aug. 30, 2012,which is hereby incorporated by reference in its entirety.

BACKGROUND

The embodiment relates to an optical lens, a light emitting device, anda lighting device having the same.

A light emitting device, for example, a light emitting diode is a kindof a semiconductor device to convert electrical energy into light. Thelight emitting device has been spotlighted as a next-generation lightsource to substitute for a fluorescent lamp and an incandescent bulbaccording to the related art.

Since the light emitting diode generates light using the semiconductordevice, the light emitting diode requires only significantly low powerconsumption when comparing with the incandescent bulb to generate lightby heating tungsten (W) or the fluorescent lamp to generate light byallowing UV (ultraviolet) light, which is generated through ahigh-intensity discharge lamp, to collide with a fluorescent body.

In addition, since the light emitting diode generates light by using thepotential gap of the semiconductor device, the light emitting dioderepresents a longer life span, a rapid response characteristic, and aneco-friendly property as compared with those of existing light sources

Accordingly, many studies and researches to substitute the existinglight sources with the light emitting diode have been carried out. Inaddition, the light emitting diodes are increasingly used as lightsources of a variety of lamps used in indoor and outdoor places andlighting devices such as liquid crystal displays, electronic displayboards, and streetlamps.

The above references are incorporated by reference herein whereappropriate for appropriate teachings of additional or alternativedetails, features and/or technical background.

SUMMARY

The embodiment provides an optical lens capable of diffusing incidentlight and a light emitting device having the same.

The embodiment provides an optical lens including convex portionsdisposed at a peripheral part of a recess portion that is recessed inthe direction of an incident surface from an apex of an exit surface andprotruding with an inflection point.

The embodiment provides an optical lens including a reflective memberdisposed in a recess portion, which is recessed in the direction of anincident surface from an apex of an exit surface, and a convex portionprotruding with an inflection point at a peripheral part of the recessportion.

The embodiment provides an optical lens including a convex portionhaving a convex curvature between an apex of an exit surface and anadjacent inflection point provided inward of the apex.

The embodiment provides an optical lens including a convex portionconvexly with an apex between a recess portion, which is recessed in theincident direction of light, and an exit surface.

The embodiment provides an optical lens including a convex portion,which is disposed between a recess portion recessed in the incidentdirection of light and an exit surface, and has a curvature smaller thana curvature of the recess portion, and a light emitting device havingthe same.

The embodiment provides an optical lens including a convex portion at aperipheral part of a recess portion recessed in the incident directionof light and a reflective member on the recess portion, and a lightemitting device having the same.

The embodiment provides an optical lens having a diffusing part recessedin the exit direction of light, at an incident part.

The embodiment provides a light emitting device with a phosphor layer ata light incidence side of an optical lens.

An embodiment provides a light emitting device including a lightemitting chip, and an optical lens on the light emitting chip. Theoptical lens includes an incident surface into which a light emittedfrom the light emitting chip is incident, a recess portion opposite tothe incident surface and recessed in a direction of the incidentsurface, an exit surface at a peripheral portion of the recess portionto output a light incident through the incident surface, and a convexportion protruding between the recess portion and the exit surface andconnected with at least one of the recess portion and the exit surfacethrough an inflection point. The convex portion is located inward of aline segment ranging from the light emitting chip to a first inflectionpoint provided at an outermost portion of the recess portion.

BRIEF DESCRIPTION OF THE DRAWINGS

The embodiments will be described in detail with reference to thefollowing drawings in which like reference numerals refer to likeelements wherein:

FIG. 1 is a side sectional view showing a light emitting deviceaccording to the first embodiment.

FIG. 2 is a side sectional view showing a light emitting deviceaccording to the second embodiment.

FIG. 3 is a partial enlarged view showing an optical lens of FIG. 2.

FIG. 4 is a side sectional view showing a light emitting deviceaccording to the third embodiment.

FIG. 5 is a partial enlarged view showing an optical lens of FIG. 4.

FIG. 6 is a side sectional view showing a light emitting deviceaccording to the fourth embodiment.

FIG. 7 is a partial enlarged view showing an optical lens of FIG. 6.

FIG. 8 is a side sectional view showing a light emitting deviceaccording to the fifth embodiment.

FIG. 9 is a partial enlarged view showing an optical lens of FIG. 8.

FIGS. 10 to 14 are views showing the distribution of orientation anglesof the light emitting devices of FIGS. 1 and 2.

FIG. 15 is a perspective view showing a light emitting device having theoptical lens of FIG. 2 according to the sixth embodiment.

FIG. 16 is a sectional view taken along line A-A of the light emittingdevice of FIG. 15.

FIG. 17 is a sectional view taken along line B-B of the light emittingdevice of FIG. 15.

FIG. 18 is a sectional view taken along line C-C of the light emittingdevice of FIG. 15.

FIG. 19 is a perspective view showing a lead frame in a light emittingdevice of FIG. 15.

FIG. 20 is a sectional view showing an example in which a lead frame isassembled with the first body in the light emitting device of FIG. 15.

FIG. 21 is a sectional view showing an example in which a first body isassembled with the second body in the light emitting device of FIG. 15.

FIG. 22 is a view showing the height of the top surface and aninclination angle of the first body in the light emitting device of FIG.15.

FIG. 23 is a side sectional view showing a light emitting deviceaccording to the seventh embodiment.

FIG. 24 is a side sectional view showing a light emitting deviceaccording to the eighth embodiment.

FIG. 25 is a side sectional view showing a light emitting deviceaccording to the ninth embodiment.

FIG. 26 is a side sectional view showing a light emitting deviceaccording to the tenth embodiment.

FIG. 27 is a side sectional view showing a light emitting deviceaccording to the eleventh embodiment.

FIG. 28 is a side sectional view showing a light emitting deviceaccording to the twelfth embodiment.

FIG. 29 is a side sectional view showing a light emitting deviceaccording to the thirteenth embodiment.

FIG. 30 is a sectional view showing one example of a light emitting chipin a light emitting device according to the embodiment;

FIG. 31 is a sectional view showing another example of a light emittingchip in a light emitting device according to the embodiment;

FIG. 32 is a perspective view showing a display apparatus having thelight emitting device according to the embodiment.

FIG. 33 is a sectional view showing a display apparatus according to theembodiment; and

FIG. 34 is an exploded perspective view showing a lighting device havingthe light emitting device according to the embodiment.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Hereinafter, the embodiments will be apparently understood to thoseskilled in the art based on accompanying drawings and the description ofthe embodiments. In the description of the embodiments, it will beunderstood that, when a layer (film), a region, a pattern, or astructure is referred to as being “on” a substrate, another layer(film), another region, or another structure, it can be “directly” or“indirectly” on the other substrate, the other layer (film), the otherregion, or the other structure, or one or more intervening layers mayalso be present. Such a position of the layer has been described withreference to the drawings.

The thickness and size of each layer shown in the drawings may beexaggerated, omitted or schematically drawn for the purpose ofconvenience or clarity. In addition, the size of elements does notutterly reflect an actual size. The same reference numbers will beassigned the same elements throughout the drawings. Hereinafter, a lightemitting device according to the embodiments will be described withreference to accompanying drawings.

FIG. 1 is a side sectional view showing a light emitting deviceaccording to the first embodiment.

Referring to FIG. 1, the light emitting device 10 includes a lightemitting chip 1, an optical lens 2 to diffuse the light emitted from thelight emitting chip 1 and output the light through an exit surface 22,and a reflective member 11 on the optical lens 2. The reflective member11 may be included in the optical lens 2 or may be provided separatelyfrom the optical lens 2, but the embodiment is not limited thereto.

The light emitting chip 1 serves a light source and selectively emitslight in the range of an ultraviolet wavelength to a visible wavelength.The light emitting chip 1 includes an UV LED chip, a green LED chip, ablue LED chip, a red LED chip, or a white LED chip. Phosphors may beapplied to a light exit region of the light emitting chip 1, but theembodiment is not limited thereto.

The light emitting chip 1 may be located at lower position than thebottom surface (e.g., incident surface) of the optical lens 2, makecontact with a portion of the bottom surface of the optical lens 2, orlocated in a recessed region of the optical lens 2. According to theembodiment, the light emitting chip 1 may be spaced apart from a lightincident surface 21 of the optical lens 2 by a predetermined distanceZ1. The distance Z1 may have the value of zero, or 0.01 mm or more. Inthis case, the central portion of the light emitting chip 1 may bedisposed concentrically with respect to the center of the optical lens2.

The direction of an optical axis (reference optical axis) Z refers to alight travelling direction on the center of the three-dimensional lightflux emitted from the light emitting chip 1. As shown in FIG. 1, for theexplanation convenience, a vertical direction upward from the lightemitting chip 1 may be defined as the optical axis Z (reference opticalaxis) or a normal line. In addition, the light emitting device 10 hasone rotational symmetry shape about the optical axis Z. In addition, itis unnecessary for the light emitting chip 1 to essentially have therotational symmetry shape. In detail, the light emitting chip 1 may havea polyhedral shape. The optical lens 2 changes the direction of thelight L output from the light emitting chip 1. In other words, theoptical lens 2 diffuses the light L by reflecting light incident to theoptical axis Z and to a region incident to the optical axis Z.

The optical lens 2 is a member to output light around the optical axisZ. The optical lens 2 serves as a light extraction lens or alateral-direction light extraction lens. The optical lens 2 is a memberto change the direction of light emitted from the light emitting chip 1.Although the optical lens 2 includes various materials, the optical lens2 may preferably include a transparent material having the refractiveindex of 1.4 to 1.7. In more preferably, the optical lens 2 may includea transparent resin material such as poly methacrylic acid methyl (PMMA)having the refractive index of 1.49, polycarbonate having the refractiveindex of 1.59, and epoxy resin (EP), or a transparent glass.

The optical lens 2 includes an incident surface 21 serving as a bottomsurface, light exit regions 22 and 23, and a recess portion 24. Theincident surface 21 perpendicularly crosses the optical axis Z.

The lengths of the optical lens 2 perpendicular to each other may beequal to each other or different from each other when viewed from theincident surface 21. For instance, the length of the optical lens 2 in alongitudinal direction may be equal to or different from the length ofthe optical lens 2 in a transverse direction when viewed from theincident surface 21, but the embodiment is not limited thereto.

The light exit regions 22 and 23 include an exit surface 22 and an outersidewall 23. The section of the exit surface 22 is formed in the shapeof a convex surface having a contour with a predetermined curvature. Theexit surface 22 diffuses light incident into the optical lens 2 andoutputs almost all light. The outer sidewall 23 connects the exitsurface 22 with the incident surface 21. The outer sidewall 23 may beperpendicularly bent from the incident surface 21 or may be connectedwith the incident surface 21 while representing a curved surface. Theouter sidewall 23 may be substantially parallel to the optical axis Z.According to another embodiment, the section of the outer sidewall 23may be formed in the shape of a convex surface with a predeterminedcurvature, but the embodiment is not limited thereto. The outer sidewall23 may serve as a surface through which light is output.

The recess portion 24 is provided in opposite side to the incidentsurface 21, and recessed toward the incident surface 21 around theoptical axis Z while representing a concave shape. The recess portion 24may have a rotational symmetry shape about the optical axis Z. Accordingto another embodiment, the recess portion 24 may have a non-rotationalsymmetry shape.

The recess portion 24 may have at least two total-reflection surfaceswhen the contour of a concave surface is divided based on an inflectionpoint. The section of each total-reflection surface may be inclined orcurved, but the embodiment is not limited thereto.

The side section of the recess portion 24 may have the shape recessedtoward the light emitting chip 1 about the optical axis Z. For instance,the recess portion 24 may have a cup shape or a vessel shape. In thiscase, the recess portion 24 has the same center as that of the opticalaxis Z. The depth of the recess portion 24 is gradually increased towardthe optical axis Z. For example, the recess portion 24 has the lowestdepth at the center thereof. The recess portion 24 has the smallestthickness between the center thereof and the incident surface 21.

The recess portion 24 has total-reflection surfaces which are providedfrom the optical axis Z toward an apex 22A of the optical lens 2 andhave curvatures different from each other or slops different from eachother. The total-reflection surfaces reflect incident light. Forexample, the recess portion 24 may include a first total-reflectionsurface 24A, a second total-reflection surface 24B, and a thirdtotal-reflection surface 24C. The center of the first total-reflectionsurface 24A is located on the optical axis Z, and the firsttotal-reflection surface 24A has a concave curved surface having apredetermined curvature. The second total-reflection surface 24B may bean inclined surface having a predetermined internal angle about theoptical axis Z or a curved surface. The second total-reflection surfaceis connected between the first and second total-reflection surfaces 24Aand 24C. The third total-reflection surface 24C is connected with thesecond total-reflection surface 24B, and located closer to the apex 22Aof the exit surface 22 than the optical axis Z. The section of the exitsurface 22 is formed in the shape of a concave surface having a contourwith a predetermined curvature. Direction changing points among thefirst, second, and third total-reflection surfaces 24A, 24B, and 24C maybe inflection points, but the embodiment is not limited thereto. In thiscase, the inflection point may be a point at which a concave curvatureis changed to a convex curvature, or the convex curvature is changedinto the concave curvature.

The recess portion 24 may have a circular rim or an oval rim when viewedfrom the top, but the embodiment is not limited thereto. The recessportion 24 may have a sink structure or a recess structure.

The optical lens 2 includes a convex portion 25 interposed between therecess portion 24 and the exit surface 22. The convex portion 25 isconnected between the recess portion 24 and the exit surface 22. Theconvex portion 25 may have a protruding structure from at least one ofthe surfaces of the recess portion 24 and the exit surface 22, or a damstructure. The convex portion 25 may be an inflected region. The convexportion 25 may have a rotational symmetry shape about the optical axisZ.

The sectional shape of the convex portion 25 includes a curved surfacehaving a convex curvature opposite to the curvature of the thirdtotal-reflection surface 24C. The convex portion 25 includes a convexcurved surface connected between the apex 22A and a first inflectionpoint P4 which is provided closest to the convex portion 25 from theapex 22A toward the recess portion 24. The first inflection point P4 isthe outermost inflection point of the recess portion 24, or the lowestinflection point of the convex portion 25. In other words, the firstinflection point P4 may be the outermost point when viewed from therecess portion 24, or may be the lowest point located closest to therecess portion 24 when viewed from the convex portion 25. The firstinflection point P4 becomes a boundary point between the recess portion24 and the convex portion 25.

The apex 22A of the exit surface 22 may be the apex of the convexportion 25 or may be the apex of the optical lens 2. At least one ofside-sectional surfaces of the first to third total-reflection surfaces24A, 24B, and 24C may include a spherical surface and/or an asphericsurface, but the embodiment is not limited thereto. In addition, theside section of the convex portion 25 may have a spherical surfaceand/or an aspheric surface.

The exit surface 22 may extend in a curved shape and/or with apredetermined slope outward of the convex portion 25, and refracts thereflected light.

In this case, when the light emitting chip 1 is employed as a referencepoint O, an angle θ1 between a first virtual segment E1, which passesthrough both of the reference point O and the first inflection point25A, and the optical axis Z may be in the range of 40° to 60°.

An angle θ11 between a second virtual segment E2, which serves as atangential line making contact with the outer curved surface of therecess portion 24 while starting from the reference point O, and theoptical axis Z is greater than the angle θ1. For example, the angle θ11may be in the range of 41° to 75°.

An angle θ12 formed between a third vertical segment E3, which serves asa tangential line making contact with the innermost curved surface ofthe convex portion 25 while starting from the reference point O, and theoptical axis Z may at an angle equal to or smaller than the angle θ1.The angle θ12 may be formed in the range of 35° to 65°.

The convex portion 25 is provided along a peripheral part of the recessportion 24, and connected between the first inflection point P4 and theapex 22A. The diameter of the convex portion 25 is shorter than a firstdiameter X1 serving as the distance between apexes 22A, and longer thana second diameter X2 serving as the distance between first inflectionpoints P4. In other words, the distance between convex portions 25 is inthe range of the first diameter X1 and the second diameter X. The firstdiameter X1 may be the diameter between the apexes 22A or the maximumdiameter of the convex portion 25. The second diameter X2 may be themaximum diameter of the recess portion 24 or the diameter between firstinflection points P4.

Since the convex portion 25 is provided inward of the second virtualsegment E2 passing the outermost portion of the recess portion 24 fromthe reference point O, the convex portion 25 hardly exerts an influenceon the light emitted from the light emitting chip 1. In other words,since the convex portion 25 is actually provided at a region to whichthe light emitted from the light emitting chip 1 is not directlyincident, the convex portion 25 may not exert an influence on thedistribution of the light orientation angle. Accordingly, the convexportion 25 may improve the product yield of the optical lens 2.

The convex portion 25 is provided thereon with the reflective member 11.The reflective member 11 directly makes contact with the surface of therecess portion 24. The reflective member 11 may include the mixture ofresin material and at least one of metallic oxide and metallic nitride.According to the embodiment, the reflective member 11 includes themixture of resin material and metallic oxide for the explanation. Theresin material includes a material such as silicon or epoxy. Inaddition, the resin material may include polyacrylate resin, epoxyresin, phenolic resin, polyamides resin, polyimides rein, unsaturatedpolyesters resin, polyphenylene ether resin (PPE), polyphenilene oxideresin (PPO), polyphenylenesulfides resin, cyanate ester resin,benzocyclobutene (BCB), Polyamido-amine Dendrimers (PAMAM),Polypropylene-imine, Dendrimers (PPI), or PAMAM-OS (organosilicon)having a PAMAM internal structure and an organic-silicon outer surfacein a single form, or may resin including the combination thereof.

The reflective member 11 may serve as a high-refraction layer or areflective layer having a refractive index higher than that of theoptical lens 2. In addition, the reflective member 11 may include alayer representing the light reflectance efficiency of 70% or more, forexample, 85% or more, but the embodiment is not limited thereto. Thereflective member 11 and the optical lens 2 may make the difference of0.1 or more, in detail, 0.3 or more in the refractive index.

The metallic oxide may have the content of 10 wt % or more, in detail,the content of 30 wt % to 80 wt % in the reflective member 11. Themetallic oxide may include at least one of TiO₂, SiO₂, and Al₂O₃representing a refractive index higher than that of the optical lens 2.Accordingly, the reflective member 11 may have the refractive indexhigher than that of the optical lens 2. For example, the reflectivemember 11 may have the refractive index of 1.7 or more. The reflectivemember 11 may include a ceramic material such as SiO₂, Si_(x)O_(y),Si₃N₄, Si_(x)N_(y), SiO_(x)N_(y), Al₂O₃, BN, Si₃N₄, SiC (SiC—BeO), BeO,CeO, or AlN.

The top surface or the high point of the reflective member 11 may bedosposed in the form of a convex surface toward the optical axis Z, aconcave surface toward the light emitting chip 1, or a flat surface, butthe embodiment is not limited thereto.

The convex portion 25 protrudes in the shape of a convex having asurface that is rapidly curved from the apex 22A of the optical lens 2.Accordingly, a point of the top surface of the reflective member 11making contact with the optical lens 2 is interposed between the firstinflection point P4 and the apex 22A.

The reflective member 11 may make contact with the surface of the convexportion 25, and may have a diameter equal to or shorter than that of theconvex portion 25.

The convex portion 25 may guide the level of the reflective member 11when the reflective member 11 is formed, and may prevent the reflectivemember 11 from being provided upward from the convex portion 25.Therefore, the convex portion 25 may prevent the reflective member 11from being formed on an unnecessary surface, so that the optical lens 2may have the desirable distribution of light orientation angles.

FIG. 2 is a side sectional view showing a light emitting deviceaccording to a second embodiment. FIG. 3 is a partial enlarged view ofan optical lens shown in FIG. 2.

Referring to FIGS. 2 and 3, a light emitting device 10A includes a lightemitting chip 1, an optical lens 2, and a reflective member 11.

A reflective member 11 is disposed on a recess portion 24 of the opticallens 2. A point of the top surface of the reflective member 11 makingcontact with the optical lens 2 may include an apex 22A of the opticallens 2 or the inner region of a convex portion 25. In this case, whenthe light emitting chip 1 is employed as a reference point O, an angleθ1 between a first virtual segment E1, which passes through the firstinflection point 25A while staring from the reference point O, and theoptical axis Z may be in the range of 40° to 60°. An angle θ11 between asecond virtual segment E2, which serves as a tangential line makingcontact with the outermost curved surface of the recess portion 24 whilestarting from the reference point O, and the optical axis Z is greaterthan the angle θ1. For example, the angle θ11 may be in the range of 41°to 75°. An angle θ12 between a third vertical segment E3, which servesas a tangential line making contact with the innermost curved surface ofthe convex portion 25 while starting from the reference point O, and theoptical axis Z may at an angle equal to or smaller than the angle θ1.The angle θ12 may be formed in the range of 35° to 65°.

The convex portion 25 may be formed in the shape of a ring interposedbetween the first inflection point P4 and the apex 22A. In other words,the convex portion 25 may be formed in the shape of a dam around therecess portion 24. The diameter of the convex portion 25 is shorter thana diameter X1 between apexes 22A of the optical lens 2 and longer than adiameter X2 of the first inflection point P4.

Since the convex portion 25 is provided inward of the second virtualsegment E2 passing the outermost portion of the recess portion 24 fromthe reference point O, the convex portion 25 hardly exerts an influenceon the light emitted from the light emitting chip 1. In other words,since the convex portion 25 is actually provided at a region to whichthe light emitted from the light emitting chip 1 is not directlyincident, the convex portion 25 may not exert an influence on thedistribution of the light orientation angle. Accordingly, the convexportion 25 may improve the product yield of the optical lens 2.

When viewed from the top, the optical lens 2 has a circular shape, and aradius D1 of the optical lens 2 is in the range of 2.50±0.5 mm, but theembodiment is not limited thereto. A distance X5 between the opticalaxis Z and the first inflection point P4 may be formed in the range of59% to 65% of the distance D1. In detail, the distance X5 may be formedin the range of 1.50±0.5 mm.

A distance X4 between the optical axis Z and the apex 22A of the exitsurface 22 corresponds to ½ of the diameter between the apexes 22A, andis longer than the distance X5. The distance X4 may be formed in therange of 65% to 71% of the radius D1. For example, the distance X4 maybe formed in the range of 1.70±0.5 mm. The segment perpendicular to thefirst inflection point P4 is spaced apart from the outermost portion ofthe optical lens 2 by a predetermined distance D3. The distance D3 maybe formed in the range of 39% to 45% of the distance D1. For example,the distance D3 may be in the range of 0.8 mm to 1.2 mm. In addition,the segment perpendicular to the apex 22A of the exit surface 22 may bespaced apart from the outermost portion of the optical lens 2 by apredetermined distance D2. The distance D2 may be shorter than thedistance D3, and may be in the range of 50% to 80% of the distance X4.For example, the distance D2 may be in the range of 0.68 mm to 0.75 mm.

The convex portion 25 is provided inward of the tangential line passingthe third total-reflection surface 24C of the recess portion 24 betweenthe first inflection point P4 and the apex 22A of the exit surface 22.

The distance X3 between the apex 22A of the exit surface 22 and thesegment perpendicular to the first inflection point P4 serves as thewidth of the convex portion 25, and may be in the range of 0.15 mm to0.19 mm. A distance Z2 of the apex 22A of the exit surface 22 and asegment parallel to the first inflection point P4 serves as the heightof the convex portion 25, and may be in the range of 0.15 mm to 0.19 mm.The convex portion 25 is provided inward of the apex 22A of the opticallens 2 to serve as the outer boundary of the reflective member 11,thereby effectively preventing the reflective member 11 from beingpositioned beyond the convex portion 25.

Referring to FIG. 3, when comparing with the maximum thickness Z4 of theoptical lens 2, a depth Z3 of the recess portion 24 may be formed in therange of 65% to 75% of the thickness Z4. The maximum thickness Z4 may beformed in the range of 50% to 60% of the distance D1, which is shorterthan the distance D1. The thickness (Z4−Z3) at the central portion ofthe optical lens 2 is the distance between the points P1 and P0, and maybe in the range of 25% to 35% of the maximum thickness Z4.

In addition, the recess portion 24 of the optical lens 2 hastotal-reflection surfaces having different curvatures outward of theoptical axis Z to reflect incident light. The recess portion 24 may havea rotational symmetry shape about the optical axis Z, but the embodimentis not limited thereto.

The optical lens 2 may extend from the recess portion 24 to the exitsurface 22 while representing inflection points. The firsttotal-reflection surface 24A of the recess portion 24 is a regionbetween a low point P1 of the first total-reflection surface 24A and achange point to the second total-reflection surface 24B, and may beconnected with the second total-reflection surface 24B through aninflection point P2. The curvature R1 of the first total-reflectionsurface 24A may be smaller than the curvature R2 of the secondtotal-reflection surface 24B and greater than the curvature R3 of thethird total-reflection surface 24C. For example, the curvature R1 may bein the range of 1 mm to 2 mm.

The curvature R2 of the second total-reflection surface 24B is acurvature of the recess portion 24 between the inflection points P2 andP3 adjacent to each other, and may be larger than the curvatures R1 andR3 of the first and third total-reflection surfaces 24A and 24C. Indetail, the curvature R2 of the second total-reflection surface 24B maybe in the range of 14 mm to 20 mm.

The curvature R3 of the third total-reflection surface 24C is thecurvature of a curved surface connecting the inflection points P3 and P4adjacent to each other. The curvature R3 of the third total-reflectionsurface 24C may be smaller than the curvatures R1 and R2 of the firstand second total-reflection surfaces 24A and 24B and the curvature R4 ofthe convex portion 25. In detail, the curvature R3 of the thirdtotal-reflection surface 24C may be in the range of 0.05 mm to 0.12 mm.The curvatures R1 and R3 of the first and third total-reflectionsurfaces 24A and 24C are curvatures of curved surfaces concaved towardthe optical axis Z. The curvatures R2 and R4 of the secondtotal-reflection surface 24B and the convex portion 25 are curvatures ofthe curved surfaces convex toward the optical axis Z. The curvature R4of the first total-reflection surface (the convex portion 25) may beformed in the range of 0.15 mm to 0.25 mm.

The curvature R4 of the convex portion 25 is at least two times smallerthan the curvature R1 of the first total-reflection surface 24A. Thecurvature R4 of the convex portion 25 is smaller than the curvatures R1and R2 of the first and second total-reflection surfaces 24A and 24B.

Since the third total-reflection surface 24C and the convex portion 25have surfaces curved in opposite direction to each other about the firstinflection point P4 and curvatures R3 and R4 different from each other,the convex portion 25 may have a rapidly-curved surface. In other words,the curvature R4 of the convex portion 25 is smaller than the curvatureof the recess portion 24 or the curvature of the third total-reflectionsurface 24C.

The exit surface 22 may have a plurality of inflection points P6 and P7interposed between the inflection point P5 connected with the convexportion 25 and the outer sidewall 23. The inflection point P5 may be anapex, but the embodiment is not limited thereto. The exit surface 22 maybe formed in the structure in which the convex curvatures R5 and R6 areformed outward of the optical axis Z. The curvatures R5 and R6 may bedifferent from each other, but the embodiment is not limited thereto.

The outer sidewall 23 may be connected between the inflection point P7and a low point P8, and may be formed in the shape of a linear contour.The position of the inflection point P7 between the exit surface 22 andthe outer sidewall 23 may be higher than the position of the low pointP1 of the recess portion 24 based on a horizontal segment, but theembodiment is not limited thereto.

As shown in FIGS. 1 and 2, a portion of the convex portion 25 is higherthan a top surface of the reflective member 11, and provided at theboundary region between the recess portion 24 and the exit surface 22.The width of the top surface of the reflective member 11 may be narrowerthan the distance (or diameter) between the apexes 22A of the opticallens 2, and wider than the distance (or diameter) between the firstinflection points P4. In addition, the peripheral part of the topsurface of the reflective member 11, which serves as a contact pointwith the optical lens 2, may be lower than the apex 22A of the opticallens 2, and may be higher than the first inflection point P4. Inaddition, a portion of the top surface of the reflective member 11 mayprotrude higher than the apex 22A of the optical lens 2, but theembodiment is not limited thereto. The contact point between the topsurface of the reflective member 11 and the optical lens 2 is positionedhigher than the segment E1.

According to the embodiment, the convex portion 25 convex in thedirection of the optical axis Z may be formed between the recess portion24 having a plurality of total-reflection surfaces 24A to 24C and theexit surface 22 to prevent the reflective member 11, which is filled inthe recess portion 24, from being provided beyond the recess portion 24.Therefore, the peripheral boundary of the reflective member 11 can bedefined, and the reflective member 11 can be prevented from exerting aninfluence on the surface of the light exit regions 22 and 23.Accordingly, the reliability for the distribution of the lightorientation angles of the optical lens 2 can be improved, so that theproduct yield can be improved.

FIG. 4 is a side sectional view showing a light emitting deviceaccording to the third embodiment, and FIG. 5 is a partial enlarged viewof the light emitting device of FIG. 4.

Referring to FIGS. 4 and 5, a light emitting device 10B includes a lightemitting chip 1, an optical lens 3 on the light emitting chip 1, and areflective member 11 on the optical lens 3.

The light emitting chip 1 may be spaced apart from an incident surface31 of the optical lens 3 by a predetermined distance Z11. The distanceZ11 may be 0.01 mm or more, but the embodiment is not limited thereto.In this case, the central portion of the light emitting chip 1 may beprovided concentrically with respect to the center of the optical lens 3

The optical lens 3 includes the incident surface 31, an exit surface 32,an outer surface 33, a recess portion 34, and a convex portion 35. Theincident surface 31 may include a flat surface or a flat surface, whichis partially grooved, but the embodiment is not limited thereto. Thelight exit region includes the exit surface 32 and the outer surface 33.The exit surface 32 may be convex outward of the optical axis Z, and theouter surface 33 may have a curved surface or a flat surface having thecontour of a vertical line.

The recess portion 34 includes a first total-reflection surface 34A, asecond total-reflection surface 34B, and a third total-reflectionsurface 34C. The first total-reflection surface 34A has the same centeras that of the optical axis Z, and has the concave shape toward thelight emitting chip 1. The recess portion 34 may have a rotationalsymmetry shape about the optical axis Z, but the embodiment is notlimited thereto. The first total-reflection surface 34A may have ahemispherical shape. The second total-reflection surface 34B is providedin the direction opposite to those of the first and thirdtotal-reflection surfaces 34A and 34C, and has a curved surface that isconvex with respect to the optical axis Z. The third total-reflectionsurface 34C has a curved surface that is concave.

The convex portion 35 has a curved surface that is convex in thedirection of the optical axis Z between the first inflection point P13and an apex 32A.

The convex portion 35 is connected between the third total-reflectionsurface 34C and the exit surfaces 32 and 33. The convex portion 35 ispositioned inward of the apex 32A of the exit surfaces 32 and 33. Inother words, the convex portion 35 is provided closer to the opticalaxis Z than the first exit surface 32. The section of the convex portion35 has a curved surface that is convex in the direction of the opticalaxis Z.

In this case, when the light emitting chip 1 is employed as a referencepoint O, an angle θ2 between the first virtual segment E1, which passesthrough both of the reference point O and the first inflection pointP13, and the optical axis Z may be in the range of 40° to 60°.

An angle θ21 between a second virtual segment E2, which serves as atangential line making contact with the outermost curved surface of therecess portion 34 while starting from the reference point O, and theoptical axis Z is greater than the angle θ2. For example, the angle θ11may be in the range of 41° to 75°.

An angle θ22 between a third vertical segment E3, which serves as atangential line making contact with the innermost curved surface of theconvex portion 35 while passing through the reference point O, and theoptical axis Z may at an angle equal to or smaller than the angle θ2.The angle θ22 may be formed in the range of 35° to 65°.

Since the convex portion 35 is connected between the first inflectionpoint P13 and the apex 32A, the diameter of the convex portion 35 isshorter than a first diameter X11 between apexes 32A of the optical lens3, and longer than a second diameter X12 between the first inflectionpoints P13. The convex portion 35 is provided between the first diameterX11 and the second diameter X12.

Since the convex portion 35 is disposed inward of the second virtualsegment E2 passing the outermost portion of the recess portion 34 fromthe reference point O, the convex portion 35 hardly exerts an influenceon the light emitted from the light emitting chip 1. In other words,since the convex portion 35 is actually provided at a region to whichthe light emitted from the light emitting chip 1 is not directlyincident, the convex portion 35 may not exert an influence on thedistribution of the light orientation angle. Accordingly, the convexportion 35 may improve the product yield of the optical lens 3.

When viewed from the top, the optical lens 3 has a circular shape, and aradius D11 of the optical lens 3 is in the range of 2.50±0.5 mm, but theembodiment is not limited thereto. The convex portion 35 may have a ringshape, and the ring shape may have a continuous dam structure.

A distance D14 between the optical axis Z and the first inflection pointP13 may be formed in the range of 50% to 55% of the radius D11. Forexample, the distance D14 may be in the range of 1.27±0.5 mm.

A distance X14 between the optical axis Z and an apex P14 of the exitsurface 32 is longer than the distance D14, and may be in the range of52% to 57% of the radius D11. For example, the distance X14 may be inthe range of 1.3±0.5 mm. The segment perpendicular to the firstinflection point P13 is spaced apart from the outermost portion of theoptical lens 2 by a predetermined distance D13. The distance D13 may beformed in the range of 45% to 50% of the radius D11. The segmentperpendicular to the apex 32A of the exit surface 32 is spaced apartfrom the outermost portion of the optical lens 3 by a predetermineddistance D12. The distance D12 may be shorter than the distance D13, andmay be in the range of 43% to 48% of the radius D11.

The convex portion 35 is provided more inward of the tangential line E2making contact with the third total-reflection surface 24C of the recessportion 34 while being interposed between the first inflection point P14and the exit surface 32.

A distance X16 between the apex 32A of the exit surface 32 and a segmentperpendicular to the first inflection point P13 is the width of theconvex portion 35. The distance X16 may be in the range of 0.05 mm to0.11 mm. A distance Z12 between the apex 32A of the exit surface 32 anda segment horizontal to the first inflection point P13 is the height ofthe convex portion 35. The distance Z12 may be formed in the range of0.05 mm to 0.11 mm. The convex portion 35 is provided inward of the apex32A of the optical lens 3 to serve as an outer boundary of thereflective member 11, thereby effectively preventing the reflectivemember 11 from being positioned beyond the convex portion 35.

Referring to FIG. 5, a thickness Z14 of the optical lens 3 may be formedin the range of 1 mm±0.2 mm, and a depth Z13 of the recess portion 34may be formed in the range of 65% to 75% of the thickness Z14 of theoptical lens 2. The thickness Z14 is smaller than the radius D11, andmay be formed in the range of 40% to 55% of the radius D11. Thethickness (Z14−Z13) at the central portion of the optical lens 3 is aninterval between points P1 and P0, and may be formed in the range of 26%to 36% of the thickness Z14.

In addition, inflection points may be formed at the recess portion 34and the exit surfaces 32 and 33 of the optical lens 3. An inflectionpoint is formed at the low point P1 of the first total-reflectionsurface 34A, and the inflection point P11 may be formed at the changepoint to the second total-reflection surface 34B from the firsttotal-reflection surface 34A. A curvature R11 of the firsttotal-reflection surface 34A may be equal to or greater than thecurvature R12 of the second total-reflection surface 34B, and greaterthan the curvature R13 of the third total-reflection surface 34C. Forexample, the curvature R11 may be formed in the range of 0.5 mm to 1 mm.

The curvature R12 of the second total-reflection surface 34B is acurvature of a curved surface connecting adjacent inflection points P11and P12 with each other. The curvature R12 may be greater than thecurvature R13 of the third total-reflection surface 34C. For example,the curvature R12 may be formed in the range of 0.5 mm to 1 mm.

The curvature R13 of the third total-reflection surface 34C is acurvature of a segment connecting adjacent inflection points P12 and P13with each other. The curvature R13 may be at least three times smallerthan the curvatures R11 and R12 of the first and second total-reflectionsurfaces 34A and 34B, and may be at least twice greater than thecurvature R14 of the convex portion 35. The curvatures R11 and R13 ofthe first total-reflection surface 34A and the third total-reflectionsurface 34C are curvatures of curved surfaces that are concave in thedirection of the optical axis Z. The curvatures R12 and R14 of thesecond total-reflection surface 34B and the convex portion 35 arecurvatures of curved surfaces that are convex in the direction of theoptical axis Z. The curvature R14 of the convex portion 35 may be formedin the range of 0.5 mm to 0.1 mm.

The curvature R13 of the third total-reflection surface 34C makes adifference from the curvature R12 of the second total-reflection surface34B and the curvature R14 of the convex portion 35 by at least twotimes. The third total-reflection surface 34C and the convex portion 35have surfaces curved in directions opposite to each other and are formedwith curvatures different from each other. Accordingly, the convexportion 35 may have a surface more rapidly curved than the thirdtotal-reflection surface 34C. The curvature R14 of the convex portion 35is smaller than the curvatures R11, R12, and R13 of the first to thirdtotal-reflection surfaces 34A, 34B, and 34C.

The exit surface 32 is connected with the outer surface 33 whilerepresenting the convex curvature R14 outward of the optical axis Z fromthe inflection point P14 connected with the convex portion 35 to thelast inflection point P15. The inflection point P14 may serve as theapex 32A of the optical lens 2 as shown in FIG. 4, but the embodiment isnot limited thereto.

The outer surface 33 is connected between the inflection point P15 ofthe exit surface 32 and the low point P16, and may have a linearcontour. The position of the inflection point P15 between the exitsurface 32 and the outer surface 33 may be provided on a line lower thanthe position of the low point P1 of the recess portion 34 based on ahorizontal segment, but the embodiment is not limited thereto.

Since the convex portion 35 protrudes from the top surface of thereflective member 11 while being positioned between the recess portion34 and the exit surface 32, the width of the top surface of thereflective member 11 may be narrower than the width (or diameter)between the apexes P14 of the optical lens 3, and may be wider than thewidth (or diameter) between the first inflection points P13. Inaddition, the peripheral portion of the top surface of the reflectivemember 11, which serves as a contact point with the optical lens 3, maybe lower than the apex P14 of the optical lens 3, and may be higher thanthe first inflection point P13.

According to the embodiment, the convex portion 35 is formed in thedirection of the optical axis Z between the recess portion 34 having aplurality of total-reflection surfaces 34A to 34C and the exit surface32. The convex portion 35 can prevent the reflective member 11, which isfilled in the recess portion 34, from being provided beyond the recessportion 34. Therefore, the boundary of the reflective member 11 can bedefined, and the reflective member 11 can be prevented from exerting aninfluence on the surface of the exit surface 32. Accordingly, thereliability for the distribution of the light orientation angles can beimproved.

FIG. 6 is a side sectional view showing a light emitting deviceaccording to the fourth embodiment, and FIG. 7 is a partial enlargedview showing the light emitting device of FIG. 6.

Referring to FIGS. 6 and 7, a light emitting device 10C includes a lightemitting chip 1, an optical lens 4 on the light emitting chip 1, and areflective member 11 on the optical lens 4.

The light emitting chip 1 may be spaced apart from a light incidentsurface 41 of the optical lens 4 by a predetermined distance Z21. Thedistance Z21 may be 0.01 mm or more, but the embodiment is not limitedthereto. In this case, the central portion of the light emitting chip 1may be provided concentrically with respect to the center of the opticallens 4.

The optical lens 4 includes the incident surface 41, an exit surface 42,an outer surface 43, a recess portion 44, and a convex portion 45. Theincident surface 41 may include a flat surface or a flat surface, whichis partially grooved, but the embodiment is not limited thereto.

The light exit region of the optical lens 4 includes the exit surface 42and the outer surface 43. The exit surface 42 may be convex outward ofthe optical axis Z, and the outer surface 43 may have a curved surfaceor a flat surface having the contour of a vertical line.

The recess portion 44 includes a first total-reflection surface 44A, asecond total-reflection surface 44B, and a third total-reflectionsurface 44C. The first total-reflection surface 44A has the same centeras that of the optical axis Z, and has the concave shape toward thelight emitting chip 1. The recess portion 44 is recessed toward thelight emitting chip 1 from an apex. The recess portion 44 may have arotational symmetry shape about the optical axis Z. The firsttotal-reflection surface 44A may have a hemispherical shape. The secondtotal-reflection surface 44B is provided in the direction opposite tothose of the first and third total-reflection surfaces 44A and 44C, andhas a curved surface that is convex with respect to the optical axis Z.The third total-reflection surface 44C has a curved surface that isconcave.

The convex portion 45 is formed with a surface convex in the directioncorresponding to the optical axis Z between first and second inflectionpoints P23 and P24.

The convex portion 45 is connected between the third reflective surface44C and the exit surface 42. The convex portion 45 is provided moreinward of an apex P23 of the exit surface 42, that is, provided closerto the optical axis Z than the first exit surface 42. The section of theconvex portion 45 has a curved surface convex in the direction of theoptical axis Z.

In this case, when the light emitting chip 1 is employed as a referencepoint O, an angle θ3 formed between a first virtual segment E1, whichpasses through both of the reference point O and the first inflectionpoint P23, and the optical axis Z may be in the range of 40° to 60°.

An angle θ31 formed between a second virtual segment E2, which serves asa tangential line making contact with the outer curved surface of therecess portion 24 while starting from the reference point O, and theoptical axis Z is greater than the angle v3. For example, the angle 11 amay be in the range of 41° to 75°.

An angle 132 a formed between a third vertical segment O3, which servesas a tangential line making contact with the innermost curved surface ofthe convex portion 45 while starting from the reference point O, and theoptical axis Z may at an angle equal to or smaller than the angle v3.The optical axis Z may be formed in the range of 35° to 65°.

Since the convex portion 45 is connected between the first and secondinflection points P23 and P24, the inner region of the convex portion 45is provided inward of a diameter X21 between apexes 45A of the opticallens 4, and provided outward of a diameter X22 between the firstinflection points P23.

Since the convex portion 45 is provided inward of the second virtualsegment E2 passing the outermost portion of the recess portion 44 fromthe reference point O, the convex portion 45 hardly exerts an influenceon the light emitted from the light emitting chip 1. In other words,since the convex portion 45 is actually provided at a region to whichthe light emitted from the light emitting chip 1 is not directlyincident, the convex portion 45 may not exert an influence on thedistribution of the light orientation angle. Accordingly, the convexportion 45 may improve the product yield of the optical lens 4.

When viewed from the top, the optical lens 4 has a circular shape, and aradius D21 of the optical lens 4 is in the range of 2.50±0.5 mm, but theembodiment is not limited thereto. The convex portion 45 may have a ringshape, and the ring shape may have a continuous dam structure along theperipheral portion of the recess portion 44.

A distance D24 between the optical axis Z and a first inflection pointP23 may be formed in the range of 60% to 70% of the radius D21. Forexample, the distance D24 may be in the range of 1.6±0.5 mm.

A distance X24 between the optical axis Z and the apex 45A is longerthan the distance D24, and may be formed in the range of 65% to 75% ofthe radius D21. For example, the distance X24 may be formed in the rangeof 1.7±0.5 mm. The segment perpendicular to the first inflection pointP23 is spaced apart from the outermost part of the optical lens 4 by apredetermined distance D23. The distance D23 may be formed in the rangeof 30% to 40% of the radius D21. The segment perpendicular to a secondinflection point P24 of the first exit surface 42 is spaced apart fromthe outermost portion of the optical lens 4 by a predetermined distanceD22. The distance D22 may be shorter than the distance D23, and may beformed in the range of 25% to 35% of the radius D21.

The inner region of the convex portion 45 is provided inward of atangential line E2, which passes a third total-reflection surface 44C ofthe recess portion 44 while making contact with the thirdtotal-reflection surface 44C of the recess portion 44, at the regionbetween the first inflection point P24 and the apex 45A.

A distance X26 between the apex 45A of the optical lens 4 and a segmentperpendicular to a first inflection point P23 is ½ of the width of theconvex portion 45. The distance X26 may be formed in the range of 0.05mm to 0.11 mm. A distance Z12 between the apex 45A and a segmenthorizontal to the first inflection point P23 is the height of the convexportion 45. The distance Z12 may be formed in the range of 0.07 mm to0.11 mm. The convex portion 45 is provided inward of the apex 45A of theoptical lens 4 to form an outer dam of the reflective member 11, therebyeffectively preventing the reflective member 11 from being providedbeyond the convex portion 45. The inner region of the convex portion 45makes contact with the reflective member 11, and the outer region of theconvex portion 45 does not make contact with the reflective member 11.The outer region of the convex portion 45 is provided in opposition tothe inner region of the convex portion 45 about the apex 45A.

Referring to FIG. 7, a thickness Z24 of the optical lens 2 may be formedin the range of 1 mm±0.5 mm, and a depth Z23 of the recess portion 44may be formed in the range of 87% to 93% of the thickness Z24 of theoptical lens 4. The thickness Z24 is smaller than the radius D21, andmay be formed in the range of 40% to 55% of the radius D21. Thethickness (Z24−Z23) at the central portion of the optical lens 4 is thedistance between the points P1 and P0, and may be in the range of 7% to13% of the thickness Z24.

In addition, an inflection point may be formed at a change point fromthe recess portion 44 of the optical lens 4 to the exit surface 42 ofthe optical lens 4. An inflection point is formed at the low point P1 ofthe first total-reflection surface 44A, and the inflection point P21 maybe formed at the change point to the second total-reflection surface 44Bfrom the first total-reflection surface 44A. A curvature R21 of thefirst total-reflection surface 44A may be smaller than a curvature R22of the second total-reflection surface 44B, and greater than a curvatureR23 of a third total-reflection surface 44C. For example, the curvatureR21 may be formed in the range of 0.4 mm to 0.9 mm.

The curvature R22 of the second total-reflection surface 44B is formedbetween the adjacent inflection points P21 and P22, and may be greaterthan the curvature R23 of the third total-reflection surface 44C. Forexample, the curvature R22 may be formed in the range of 6.5 mm to 7.5mm.

The curvature R23 of the third total-reflection surface 44C is acurvature of a curved surface connecting the adjacent inflection pointsP22 and P23. The curvature R23 may be smaller than the curvature R21 ofthe first total-reflection surface 44A by at least three times, and maybe greater than the curvature R24 of the convex portion 45 by at leasttwice. The curvatures R21 and R23 of the first and thirdtotal-reflection surfaces 44A and 44C are curvatures of curved surfacesthat are concave in the direction of the optical axis Z. The curvatureR24 of the convex portion 45 is a curvature of a curved surface that isconvex in the direction of the optical axis Z. The curvature R24 of theconvex portion 45 may be formed in the range of 0.7 mm to 0.12 mm.

Since the curvature R23 of the third total-reflection surface 44C isgreater than the curvature R24 of the convex portion 45 by at leasttwice, the contour connected with the convex portion 45 may have arapidly curved surface. The curvature R24 of the convex portion 45 issmaller than the curvatures R21, R22, and R23 of the first to thirdtotal-reflection surfaces 44A, 44B, and 44C.

The exit surface 42 is connected with the outer surface 43 whilerepresenting a convex curvature R24 outward of the optical axis Z from asecond inflection point P24 connected with the convex portion 45 to theinflection point P25. The inflection point P24 is provided outward ofthe apex 45A of the optical lens 4.

The outer surface 43 is connected between an inflection point P25 and alow point P26 of the exit surface 42, and may be formed in the shape ofa linear contour. The position of the inflection point P25 between theexit surface 42 and the outer surface 43 may be higher than the positionof the low point P1 of the recess portion 44 based on a horizontalsegment, but the embodiment is not limited thereto.

Since a boundary is set at the top surface of the reflective member 11by the convex portion 45, the width of the top surface of the reflectivemember 11 may be narrower than the width (or diameter) between apexes45A of the optical lens 4, and may be wider than the width (or diameter)between the first inflection points P23. In addition, the peripheralportion of the top surface of the reflective member 11, which serves asa contact point with the optical lens 4, may be lower than the apex P45Aof the optical lens 4, and may be higher than the first inflection pointP23.

According to the embodiment, the convex portion 45 is formed in thedirection of the optical axis Z between the recess portion 44 having aplurality of total-reflection surfaces 44A to 44C and the exit surface42. The convex portion 45 can prevent the reflective member 11, which isfilled in the recess portion 44, from being provided beyond the recessportion 44. Therefore, the boundary of the reflective member 11 can bedefined, and the reflective member 11 can be prevented from exerting aninfluence on the surfaces of the exit surfaces 42 and 43. Accordingly,the reliability for the distribution of the light orientation angles canbe improved.

FIG. 8 is a side sectional view showing a light emitting deviceaccording to the fifth embodiment. FIG. 9 is a partial enlarged view ofFIG. 8.

Referring to FIG. 8, a light emitting device 10D includes a lightemitting chip 1, an optical lens 5 on the light emitting chip 1, and areflective member 11 on the optical lens 5.

The light emitting chip 1 may be spaced apart from a light incidentsurface 51 of the optical lens 5 by a predetermined distance Z31. Thedistance Z31 may be 0.01 mm or more, but the embodiment is not limitedthereto. In this case, the central portion of the light emitting chip 1may be provided concentrically with respect to the center of the opticallens 5

The optical lens 5 includes an incident surface 41, an exit surface 42,an outer surface 53, a recess portion 44, and a convex portion 45. Theincident surface 51 may include a flat surface or a flat surface, whichis partially grooved, but the embodiment is not limited thereto.

The light exit region of the optical lens 5 includes the exit surface 52and the outer surface 53. The exit surface 52 may be convex outward ofthe optical axis Z, and the outer surface 53 may have a curved surfaceor a flat surface having the contour of a vertical line.

The recess portion 54 includes a first total-reflection surface 54A, asecond total-reflection surface 54B, and a third total-reflectionsurface 54C. The first total-reflection surface 54A has the same centeras that of the optical axis Z, and has the concave shape in thedirection of the light emitting chip 1. The recess portion 54 may berecessed in the direction of the light emitting chip 1, and may have arotational symmetry shape about the optical axis Z. The firsttotal-reflection surface 54A may have a hemispherical shape. The secondtotal-reflection surface 54B is provided in the direction opposite tothose of the first and third total-reflection surfaces 54A and 54C, andhas a curved surface that is convex with respect to the optical axis Z.The third total-reflection surface 54C has a curved surface that isconcave.

The convex portion 55 has a curved surface that is convex in thedirection of the optical axis Z between a first inflection point P34 andan apex 55A.

The convex portion 55 is connected between the third total-reflectionsurface 54C and the exit surfaces 52 and 53. The convex portion 55 hasthe apex 55A of the optical lens 5. In other words, the convex portion55 is provided closer to the optical axis Z than the first exit surface52. The section of the convex portion 55 has a curved surface that isconvex in the direction of the optical axis Z.

In this case, when the light emitting chip 1 is employed as a referencepoint O, an angle θ4 formed between a first virtual segment E1, whichpasses through both of the reference point O and the first inflectionpoint P34, and the optical axis Z may be in the range of 40° to 60°.

An angle θ41 formed between a second virtual segment E2, which serves asa tangential line making contact with the outer curved surface of therecess portion 54 while starting from the reference point O, and theoptical axis Z is greater than the angle θ5. For example, the angle θ41may be in the range of 41° to 75°.

An angle θ42 formed between a third vertical segment E3, which serves asa tangential line making contact with the innermost curved surface ofthe convex portion 55 while starting from the reference point O, and theoptical axis Z may at an angle equal to or smaller than the angle θ4.The optical axis Z may be formed in the range of 35° to 65°.

The convex portion 55 is formed in a ring shape between the firstinflection point P34 and the apex 55A. The ring shape protrudes aroundthe recess portion 54 while representing a dam shape. The diameter ofthe convex portion 55 is shorter than a diameter X31 between apexes 55Aof the optical lens 5, and wider than a diameter X32 between the firstinflection points P34.

Since the convex portion 55 is provided inward of the second virtualsegment E2 passing the outermost portion of the recess portion 24 fromthe reference point O, the convex portion 55 hardly exerts an influenceon the light emitted from the light emitting chip 1. In other words,since the convex portion 55 is actually provided at a region to whichthe light emitted from the light emitting chip 1 is not directlyincident, the convex portion 55 may not exert an influence on thedistribution of the light orientation angle. Accordingly, the convexportion 55 may improve the product yield of the optical lens 2.

When viewed from the top, the optical lens 5 has a circular shape, and adiameter of the optical lens 5 is in the range of 2.50±0.5 mm, but theembodiment is not limited thereto.

A distance D34 between the optical axis Z and the first inflection pointP34 may be formed in the range of 75% to 85% of the distance D31. Forexample, the distance D34 may be formed in the range of 2.0±0.5 mm.

A distance X34 between the optical axis Z and a second inflection pointP35 of the exit surface 52 is longer than the distance D34, and may beformed in the range of 82% to 86% of the radius D31. For example, thedistance D34 may be formed in the range of 2.1±0.2 mm. The segmentperpendicular to the first inflection point P34 is spaced from theoutermost portion of the optical lens 5 by a predetermined distance D32,and the distance D32 may be formed in the range of 15% to 25% of theradius D31. The segment perpendicular to the apex 55A is spaced apartfrom the outermost portion of the optical lens 5 by the distance D32,and the distance D32 may be shorter than the radius D31.

The apex 55A of the convex portion 55 is provided inward of thetangential line making contact with the third total-reflection surface54C of the convex portion 55 at the region between the first inflectionpoint P34 and the apex P35 (e.g, second inflection point) of the exitsurface 52.

A distance X36 between the apex 55A and a segment perpendicular to thefirst inflection point P34 is in the range of ½ to ⅓ of the width of theconvex portion 55. The distance X36 may be formed in the range of 0.06mm to 0.12 mm. A distance Z34 between the apex 55A and a segmenthorizontal to the first inflection point P34 is a height of the convexportion 55. The distance Z34 may be in the range of 0.03 mm to 0.07 mm.The inner region of the convex portion 55 is provided inward of the apex55A of the optical lens 5, to serve as an outer boundary of thereflective member 11, thereby effectively preventing the reflectivemember 11 from being positioned beyond the convex portion 55.

Referring to FIG. 9, a thickness Z34 of the optical lens 5 may be formedin the range of 0.8 mm±0.2 mm, and a depth Z33 of the recess portion 54may be formed in the range of 87% to 92% of the thickness Z34 of theoptical lens 5. The thickness Z54 is smaller than the radius D11, andmay be formed in the range of 30% to 55% of the radius D11. Thethickness (Z34−Z33) at the central portion of the optical lens 3 is aninterval between points P1 and P0, and may be formed in the range of 8%to 13% of the thickness Z34.

In addition, inflection points may be formed at the recess portion 54and the exit surfaces 52 and 53 of the optical lens 5. An inflectionpoint is formed at the low point P1 of the first total-reflectionsurface 54A, and the inflection point P31 may be formed at the changepoint to the second total-reflection surface 54B from the firsttotal-reflection surface 54A. A curvature R31 of the firsttotal-reflection surface 54A is a curvature of a curved surface that isconcave in the direction of the optical axis Z. The curvature R31 may begreater than a curvature R33 of the third total-reflection surface 54C.The curvature R31 may be formed in the range of 0.7 mm to 1 mm.

The second total-reflection surface 54B includes a plurality ofinflection points P31, P32, and P33 between the first and thirdtotal-reflection surfaces 54A and 54C, and is connected therebetweenthrough convex curved surfaces. A curvature R32 of a contour between theinflection points P31 and P32 at the second total-reflection surface 54Bmay be smaller than the curvature R33 of the contour between theinflection points P32 and P33. The curvature R32 may be 1 mm or less,and the curvature R33 may be 6 mm or more.

The curvature R34 of the third total-reflection surface 54C is thecurvature of a curved surface connecting the inflection points P53 andP54 adjacent to each other. The curvature R34 may be smaller than thecurvature R31 of the first total-reflection surface 54A by at leastthree times, and may be greater than the curvature R35 of the convexportion 55 by at least two times. The curvatures R31 and R33 of thefirst and third total-reflection surfaces 54A and 54C are curvatures ofcurves surfaces that are concave in the direction of the optical axis Z.The curvature R35 of the convex portion 55 may be formed in the range of0.8 mm to 0.12 mm.

The curvature R34 of the third total-reflection surface 54C makes adifference from the curvature R35 of the convex portion 55 by at leasttwo times. Since the direction of the curved surface of the convexportion 55 is opposite to the direction of the curved surface of thethird total-reflection surface 54C, the convex portion 55 may have arapidly-curved surface. The curvature R35 of the convex portion 55 issmaller than the curvatures R31 and R32 of the first and secondtotal-reflection surfaces 54A and 54B.

The exit surface 52 is connected with the outer surface 33 whilerepresenting the convex curvature R36 outward of the optical axis Z fromthe inflection point P35 connected with the convex portion 55 to thelast inflection point P36. The inflection point P35 is provided outwardof the apex 55A of the optical lens 5.

The outer surface 53 may be connected between the inflection point P36of the exit surface 52 and a low point P37, and may be formed in theshape of a linear contour. The position of the inflection point P36between the exit surface 52 and the outer surface 53 may be higher thanthe position of the low point P1 of the recess portion 54 based on ahorizontal segment, but the embodiment is not limited thereto.

Since a boundary is set at the top surface of the reflective member 11by the convex portion 55, the width of the top surface of the reflectivemember 11 may be narrower than the width (or diameter) between apexes55A of the optical lens 5, and may be wider than the width (or diameter)between the first inflection points P34. In addition, the peripheralportion of the top surface of the reflective member 11, which serves asa contact point with the optical lens 5, may be lower than the apex P55Aof the optical lens 5, and may be higher than the first inflection pointP34.

According to the embodiment, the convex portion 55 is formed in thedirection of the optical axis Z between the recess portion 54 having aplurality of total-reflection surfaces 54A to 54C and the exit surface52. The convex portion 55 can prevent the reflective member 11, which isfilled in the recess portion 54, from being provided beyond the recessportion 54. Therefore, the boundary of the reflective member 11 can bedefined, and the reflective member 11 can be prevented from exerting aninfluence on the surface of the exit surfaces 52 and 53. Accordingly,the reliability for the distribution of the light orientation angles canbe improved.

The reflective member provided on the recess portion of the optical lensdisclosed according to the first to fourth embodiments may be omitted,but the embodiment is not limited thereto.

FIGS. 10 to 14 are views showing the distribution of light orientationangles through the optical lenses according to the first and secondembodiments.

FIGS. 10 and 11 show cases that the reflective member is not applied tothe optical lens according to the embodiment, and show the distributionof the light orientation angles in first and second directionsperpendicular to each other. The distribution characteristic of lightshown in FIG. 10 represents the distribution of the orientation anglesin the first direction (longitudinal direction or lengthwise direction)of the optical lens. The distribution characteristic of light shown inFIG. 11 represents the distribution of the orientation angles in thesecond direction (transverse direction or widthwise direction) of theoptical lens. In this case, the widthwise direction of the optical lensis a longitudinal direction, and a direction perpendicular to atransverse direction (or widthwise direction) of the optical lens. Thelength of the optical lens in the longitudinal direction may be equal toor different from the length of the optical lens in the transversedirection.

FIGS. 12 and 13 show cases that a reflective member is applied to theoptical lens according to the embodiment. FIGS. 12 and 13 show thedistribution of the wide light orientation angles in the first andsecond directions, for example, shows the distribution of theorientation angles more than 155°. In addition, when the reflectivemember is applied, the intensity of a center beam is represented with30% or less in FIG. 12, and represented with 35% or less in FIG. 13.

FIG. 14 is a view showing a ray tracing result in the light emittingdevice of FIG. 2, in which light is not incident into the convex portion25 of the optical lens 2. The convex portion 25 defines the boundary ofthe reflective member 11 to prevent the exit surface 22 of the opticallens 2 from being affected by the reflective member 11. The assemblingstructure of the disclosed light emitting device having the optical lens2 with the light emitting chip 1 may be modified, and the detailsthereof will be described in the following embodiments.

FIG. 15 is a perspective view showing a light emitting device accordingto the sixth embodiment, and FIG. 16 is a sectional view taken alongline A-A of the light emitting device shown in FIG. 15. FIG. 17 is asectional view taken along line B-B of the light emitting device shownin FIG. 15. FIG. 18 is a sectional view taken along line C-C of thelight emitting device shown in FIG. 15. FIG. 19 is a perspective viewshowing a lead frame of the light emitting device of FIG. 15.

Referring to FIGS. 15 to 19, a light emitting device 100 includes aplurality of lead frames 121 and 131 spaced apart from each other, afirst body 141 provided in the lead frames 121 and 131, a second body151 having a first opening 150 and made of a material different fromthat of the first body 141 on the first body 141, a light emitting chip161 provided on at least one of the lead frames 121 and 131, atransparent resin layer 171 formed in the first opening 150 whilesurrounding the light emitting chip 161, and an optical lens 181 on thetransparent resin layer 171 and the second body 151.

According to the light emitting device 100, a first direction X mayrefer to the direction of a length W1, a second direction Zperpendicular to the first direction X may refer to a width W3, and adirection perpendicular to a top surface of the light emitting chip 161may refer to the direction Y of a normal line to the light emitting chip161.

The length W1 of the light emitting device 100 may be the distancebetween the lateral sides of the lead frames 121 and 131, and may belonger than a length W2 of the first body 141. End portions of the leadframes 121 and 131 may protrude out of an outer sidewall of the firstbody 141 to adhere to an adhesive member such as a solder paste. Thewidth of the light emitting device 100 may be the width W3 of the firstbody 141. Since the width W3 of the first body 141 is wider than a widthW4 of each of the lead frames 121 and 131, the light orientation anglecan be provided with a wide distribution.

As shown in FIGS. 16 and 19, the lead frames 121 and 131 include thefirst lead frame 121 and the second lead frame 131. The first lead frame121 includes a first groove 123 and a first hole 122. The first groove123 may be formed at a depth lower than that of a top surface of thefirst lead frame 121, and provided at a peripheral portion of a chipregion A1. In this case, the peripheral portion of the chip region A1may be a region between the chip region A1 and one lateral side of thefirst lead frame 121, or at least two lateral sides of the first leadframe 121. The thickness of the first lead frame 121 in the first groove123 may be equal to the thickness of a portion of the first lead frame121 without the first groove 123, or may have a thickness as thin asthat of the region of the first groove 123. Therefore, a portion of thefirst lead frame 121 opposite to the first groove 123 may protrude ormay have a flat structure. A plurality of first holes 122 are spacedapart from each other, and provided between the first groove 123 and thelateral sides of the first lead frame 121.

The second lead frame 131 includes a second groove 133 and a second hole132. The second groove 133 has a depth lower than that of a top surfaceof the second lead frame 131, and is lengthwise formed along thedirection of a width W4 of the second lead frame 131. The width of thesecond groove 133 may be longer than the length A4 of the second leadframe 131. The second groove 133 may be provided at the outside of abonding region A2, that is, at an opposite region of the first leadframe 121. A plurality of holes 132 may be arranged with a predeterminedinterval therebetween at the outside of the second groove 133. Thesecond lead frame 131 at the second groove 133 may have the thicknessequal to that of a portion of the lead frame 131 without the secondgroove 133, or may have the thickness as thin as the depth of the secondgroove 133. Therefore, a portion of the second lead frame 131 oppositeto the second groove 133 may protrude or may have a flat structure.

The width A3 of the first lead frame 121 may be longer than the width A4of the second lead frame 131. In addition, the first lead frame 121having the light emitting chip may be formed with a wider area.

The first and second lead frames 121 and 131 includes at least one ofmetallic materials such as titanium (Ti), copper (Cu), nickel (Ni), gold(Au), chrome (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag),phosphorous (P). The first and second lead frames 121 and 131 mayinclude a single metallic layer or metallic layers different from eachother, but the embodiment is not limited thereto.

One or at least two of the first holes 122 and the second holes 132 mayhave a wider lower portion and a narrower upper portion. At least of thefirst and second holes 122 and 132, and the first and second grooves 123and 133 may not be formed.

A first end portion 124 of the first lead frame 121 corresponds to asecond end portion 134 of the second lead frame 131. A gap 115 betweenthe first end portion 124 of the first lead frame 121 and the second endportion 134 of the second lead frame may have an interval G1 at theouter portion thereof greater than an interval at the center thereof, ormay have the same interval at the outer portion and the center thereof.The first end portion 124 of the first lead frame 121 is closer to thesecond end portion 134 of the second lead frame 131 are provided with anarrower interval therebetween, so that the bonding space among thelight emitting chip 161, a first wire 166, and a second wire 167 can beensured.

The first lead frame 121 includes the first end portion 124 and a firststep structure 128 formed along both bent lateral sides of the first endportion 124. In the first step structure 128, an outer peripheral regionof the bottom surface of the first lead frame 121 has a step structure.The first step structure 128 may be disposed in at least one lateralside of the first lead frame 121, but the embodiment is not limitedthereto.

The second lead frame 131 includes the second end portion 134 and asecond step structure 138 formed along both bent lateral sides of thesecond end portion 134. In the second step structure 138, an outerperipheral region of the bottom surface of the second lead frame 131 hasa step structure. The second step structure 138 may be formed in atleast one lateral side or at least two lateral sides of the second leadframe 131, but the embodiment is not limited thereto.

Although an example that two lead frames are formed in one group hasbeen described, at least three lead frames may be formed. In addition,when viewed from the top, the first and second lead frames 121 and 131may have a rectangular shape or another shape. In addition, at least aportion of the lead frames 121 and 131 may be bent, but the embodimentis not limited thereto.

As shown in FIGS. 16, 17, 19, and 20, the first body 141 is disposed onthe first and second lead frames 121 and 131. The first body 141 spacesthe first lead frame 121 from the second lead frame 131. The first body141 supports and fixes the first and second lead frames 121 and 131.

The bottom surface of the first body 141 may be aligned in line with thebottom surfaces of the first and second lead frames 121 and 131. A topsurface 147 may be spaced apart from the top surfaces of the first andsecond lead frames 121 and 131.

The first body 141 may include a material representing reflectancehigher than transmittance with respect to the wavelength emitted from alight emitting chip 161. For example, the first body 141 may include amaterial representing reflectance of 70% or more. If the reflectance is70% or more, the material of the first body 141 may be a non-transparentmaterial. The first body 141 may include an insulating material based onresin. For example, the first body 141 may include a resin material suchas polyphthalamide (PPA). The first body 141 may include silicon, epoxyresin, thermosetting resin including a plastic material, a high heatresistance material, and a high heat resistance material. The siliconincludes white color resin. In addition, the first body 141 mayselectively include acid anhydride, an antioxidant, a release agent, anoptical reflector, an inorganic filling agent, a curing catalyst, alight stabilizer, a lubricant, or a titanium dioxide. The first body 141may be molded by using at least one selected from the group consistingof epoxy resin, modified epoxy resin, silicon resin, modified siliconresin, acrylic resin, and urethane resin. For instance, the first body141 can be formed by using B-stage solid epoxy resin composition, whichcan be obtained by mixing the epoxy resin, such astriglycidylisocyanurate or hydride bisphenol A diglycidylether, with theacid anhydride promoter, such as hexahydro phthalic anhydride, 3-methylhexahydro phthalic anhydride or 4-methyl hexahydro phthalic anhydride,and then partially hardening the mixture after adding DBU(1.8-Diazabicyclo(5,4,0)undecene-7) serving as a hardening acceleratorand ethylene glycol, titanium oxide pigment or glass fiber serving as apromoter to the epoxy resin, but the embodiment is not limited thereto.

In addition, a light shielding material or a diffusing agent iscontained in the first body 141, so that transmitted light can bereduced. Further, the first body 141 includes the mixture of thethermosetting resin and at least one selected from the group consistingof a diffusing agent, pigments, a phosphor material, a reflectivematerial, a light-shielding material, a light stabilizer, and alubricant, so that the first body 141 has a predetermined function.

The top surface 147 of the first body 141 is formed with an area largerthan that of the bottom surface of the second body 151, therebyreflecting light traveling in the direction of the top surface 147 ofthe first body 141, so that light loss can be reduced.

Referring to FIGS. 20 and 22, a portion of the first body 141 under thetop surface of the lead frames 121 and 131 may be defined as a lowerregion of the first body 141, and a portion of the first body 141 on thetop surface of the lead frames 121 and 131 may be defined as an upperregion. In addition, the top surface 147 of the first body 141 may beclassified into first and second top surface portions B3 and B4. Thefirst top surface portion B3 may be closer to the light emitting chip161 than the second top surface portion B4. The thickness of the firsttop surface portion B3 is gradually increased toward the outsidethereof, so that an inclination surface may be formed. The second topsurface portion B4 has a thickness greater than that of the first topsurface portion B3, so that the second top surface portion B4 may have aflat surface or an inclined surface.

The maximum distance between the top surface 147 of the first body 141and the top surface of the lead frames 121 and 131 is a thickness T1 ofthe second top surface portion B4 of the first body 141. The thicknessT1 may be 50 μm or more. For example, the thickness T1 may be formed inthe range of 50 μm to 300 μm. In this case, the thickness T1 of thesecond top surface portion B4 of the first body 141 may represent thethickest thickness in the upper region. In addition, the top surface 147of the first body 141 may be provided on a line horizontally extendingfrom the top surface of the light emitting chip 161, or the difference(T2−T1) between the line horizontally extending from the top surface 147of the light emitting chip 161 and the top surface 147 of the first body141 may be made to at least 1 μm, so that the light emitted from thelight emitting chip 161 can be effectively incident and reflected. Thefirst top surface portion B3 has a thickness thinner than that of thesecond top surface portion B4, so that a second light L2 travelling in ahorizontal direction from the light emitting chip 161 can be effectivelyreflected as shown in FIG. 2.

A thickness T2 of the light emitting chip 161 may be formed in the rangeof 80 μm to 500 μm. For example, the thickness T2 may be formed in therange of 80 μm to 150 μm, but the embodiment is not limited thereto.

The first top surface portion B3 of the first body 141 may have aninclined surface which is not parallel to the top surfaces of the leadframes 121 and 131. For example, an angle between the first top surfaceportion B3 of the first body 141 and the top surfaces of the lead frames121 and 131 may be formed in the range of 1° to 25°.

The second top surface portion B4 of the first body 141 may be parallelto the top surfaces of the lead frames 121 and 131. In this case, anangle θ5 between a line E4 extending from the first top surface portionB3 of the first body 141 and the normal line Z perpendicular to the topsurface of the light emitting chip 161 may be 89° or less. For example,the angle θ5 may be formed in the range of 65° to 89°. An internal angleof the first top surface portion B3 of the first body 141 may be formedin the range of 135° to 180°. The light orientation angles of the lightemitting device can be adjusted according to the angle θ5 between theline E4 extending from the first top surface portion B3 of the firstbody 141 and the normal line Z perpendicular to the top surface of thelight emitting chip 161.

As shown in FIGS. 16 and 20, the first body 141 includes a separationpart 142 and first to fourth coupling parts 143, 144, 145, and 146. Theseparation part 142 is provided in the gap 115 between the first andsecond lead frames 121 and 131. The width of a lower portion of theseparation part 141 may be larger than the width of an upper portion ofthe separation part 141. The top surface of the separation part 141 maybe formed horizontally to the top surfaces of the lead frames 121 and131, or may be formed higher than the top surfaces of the lead frames121 and 131. In this case, when the upper portion of the separation part142 is higher than the top surfaces of the lead frames 121 and 131, theupper portion of the separation part 142 makes contact with the topsurfaces of the first end portion 124 of the first lead frame 121 andthe second end portion 134 of the second lead frame 131, therebypreventing moisture from being infiltrated.

The first coupling part 143 is formed in the first hole 122 of the firstlead frame 121, and the second coupling part 144 is formed in the secondhole 132 of the second lead frame 131. The third coupling part 145 isformed in the first groove 123 of the first lead frame 121, and thefourth coupling part 146 is formed in the second groove 133 of thesecond lead frame 131. The first body 141 may be tightly coupled withthe first and second lead frames 121 and 131 through the separation part142 and the first to fourth coupling parts 142, 144, 145, and 146.

As shown in FIGS. 20 and 21, the inner portion 148 of the first body 141further extends between the first groove 123 of the first lead frame 121and an opening 150-1, so that the contact area between the first body141 and the inner portion 152A of the second body 151 can be increased.

The first body 141 serves as a member to effectively reflect light ofthe light emitting chip 161, which may include a resin molded member.The first body 141 may be provided at the center thereof with theopening 150-1. The top surfaces of the first and second lead frames 121and 131 may be exposed through the opening 150-1. The opening 150-1 mayhave a circular shape, a polygonal shape, or a shape having a curvedsurface. The first body 141 may have a substantially rectangularparallepiped shape. The outer peripheral portion of the first body 141may have a polygonal shape when viewed from the top. Although the firstbody 141 has the rectangular parallelepiped shape, the first body 141may have an oval shape, a circular shape, or another polygonal shapewhen viewed from the top.

As shown in FIGS. 15 and 16, an outer portion of the first lead frame121 protrudes from the lower portion of a first outer surface S1 amongfour outer surface constituting the first body 141, and an outer portionof the second lead frame 131 protrudes from the lower portion of asecond outer surface S2 opposite to the first outer surface S1. As shownin FIGS. 15 and 18, third and fourth outer surfaces S3 and S4 of thefirst body 141, which are opposite to each other, are formed outward ofthe outer surfaces of the first and second lead frames 121 and 131. Anouter portion 149 of the first body 141 covers the outer surfaces of thefirst and second lead frames 121 and 131. A lower end portion 149Aextends to the bottom surfaces of the first and second lead frames 121and 131 from the outer portion 149 of the first body 141, so that thelower end portion 149A can be coupled with the step structures 128 and138 as shown in FIG. 5.

As shown in FIG. 16, the second body 151 may be formed on the first body141. The second body 151 may include a transparent material. Forexample, the second body 151 may include silicone resin or epoxy resin.The second body 151 may be formed through an injection molding scheme,and may include a transparent material. Accordingly, the second body 151can effectively transmit first and second light L1 and L2 emitted fromthe light emitting chip 161.

An outer surface S5 of the second body 151 is provided inward of theouter sidewall 23 of the optical lens 2, and may make contact with aportion of the outer sidewall 23 of the optical lens 2. Accordingly, thecoupling forth between the second body 151 and the optical lens 2 isincreased. When viewed from the top, the second body 151 may have acircular shape. According to another embodiment, the second body 151 mayhave a polygonal shape or an oval shape, but the embodiment is notlimited thereto. Although the description has been made in that thesecond body 151 has the vertical outer surface S5, the second body 151may have a curved surface such as a hemispherical shape. The outersurface having the shape of a curved surface can provide a wider lightexit surface.

The width of the second body 151 may be smaller than the width W4 of thefirst body 141 as shown in FIG. 15. According to the embodiment, thewidth of the second body 151 may be equal to or greater than the widthW4 of the first body 141. Accordingly, the contact area between thefirst and second bodies 141 and 151 is increased, thereby preventingmoisture from being infiltrated into the interfacial surface between thefirst and second bodies 141 and 151 having different materials, so thatthe reliability of the package can be improved.

The second body 151 includes the second thermosetting resin representingthe transmittance of 70% or more with respect to the wavelength emittedfrom the light emitting chip 161. The second thermosetting resin mayinclude at least one selected from the group consisting ofsilicon-containing resin, transparent epoxy resin, modified epoxy resin,transparent silicon resin, modified silicon resin, acrylate resin, andurethane resin. In the second body 151, at least one selected from thegroup consisting of a filler, a diffusing agent, pigments, a phosphormaterial, and a reflective material may be mixed with the secondthermosetting resin, so that the second body 151 has a predeterminedfunction. In addition, the second thermosetting resin may contain adiffusing agent. For example, the diffusing agent may include bariumtitanate (BaTiO3), titanium oxide (TiO₂), aluminum oxide (Al₂O₃) orsilicon oxide (SiO₂).

As shown in FIGS. 20 and 21, the second body 151 has the first opening150, and the first opening 150 may correspond to the central regions ofthe lead frames 121 and 131. The first opening 150 may have a widthsmaller than that of the opening 150-1 of the first body 141. An innerlateral side 152 of the second body 151 may be perpendicular to the topsurface of the first lead frame 121 or the top surface of the secondlead frame 131, or may be inclined at an angle of 90° to 180°.

The inner portion 152A of the second body 151 is closer to the lightemitting chip 161 than the inner portion 148 of the first body 141, andmay make contact with the top surfaces of the lead frames 121 and 131.In addition, the inner portion 152A of the second body 151 makes contactwith the top surface of the first body 141, so that the adhesivestrength between the inner portion 152A of the second body 151 and thefirst body 141 can be increased. The structure can effectively preventmoisture from being infiltrated.

The height (or thickness) of the inner lateral side 152 of the secondbody 151 may be thicker than the thickness of the light emitting chip161, and may be formed higher than the high point of the wires 166 and167 of FIG. 16. For example, the height of the inner lateral side 152 ofthe second body 151 may be formed in the range of 250 μm or 500 μm, butthe embodiment is not limited thereto. When viewed from the top, in theopening 150, the length in the direction of an X axis may be differentfrom the width in the direction of a Z axis or may be equal to the widthin the direction of the Z axis, but the embodiment is not limitedthereto.

As shown in FIG. 21, a concave-convex structure, a roughness structure,or a step structure may be formed at the upper portion of the secondbody 151. In addition, the second body 151 is provided thereon with afirst protrusion 153 protruding from an inner upper portion thereof, asecond protrusion 155 protruding from an outer upper portion thereof,and a third groove 154 formed between the first and second protrusions153 and 155. The first and second protrusions 153 and 155 may protrudewith the same height or different heights. The third groove 154 may beformed at the depth lower than that of the top surface of the firstprotrusion 153. The adhesive strength between the optical lens 2 and thesecond body 151 may be increased due to the first and second protrusions153 and 155 and the third groove 154 formed at the upper portion of thesecond body 151 as shown in FIG. 16.

As shown in FIG. 16, one or at least two light emitting chips 161 may beprovided on at least one of the first and second lead frames 121 and 131exposed through the bottom of the first opening 150 of the first body141.

The light emitting chip 161 may be provided on the first lead frame 121and connected to the first lead frame 121 through a first wire 165. Thelight emitting chip 161 may be connected to the second lead frame 131through a second wire 166. The light emitting chip 161 is driven byreceiving power from the first and second lead frames 121 and 131.

According to another embodiment, the light emitting chip 161 may bedie-bonded to the first lead frame 121, and may be connected to thesecond lead frame 131 through a wire. The light emitting chip 161 may bebonded to the first and second lead frames 121 and 131 through aflip-chip bonding scheme.

The light emitting chip 161 may include an LED chip including asemiconductor compound. The light emitting chip 161 may include at leastone of an ultraviolet LED chip, a blue LED chip, a green LED chip, awhite LED chip, and a red LED chip. The light emitting chip 161 mayinclude a group III-V compound semiconductor. An active layer in thelight emitting chip 161 may include at least one of a double bondingstructure, a single well structure, a multiple well structure, a singlequantum well structure (SQW), a multi quantum well (MQW) structure, aquantum wire structure, and a quantum dot structure. The active layer isprovided by alternately providing well and barrier layers. Thelamination structure of the well/barrier layers such as the laminationstructure of InGaN/GaN, GaN/AlGaN, InGaN/AlGaN, InGaN/InGaN, orInAlGaN/InAlGaN may be formed at 2 to 30 cycles. In addition, the activelayer may include a semiconductor such as ZnS, ZnSe, SiC, GaP, GaAlAs,AlN, InN, or AlInGaP, but the embodiment is not limited thereto. Thelight emission wavelength of the active layer may be selected from therange of an ultraviolet band wavelength to a visible band wavelength,but the embodiment is not limited thereto.

Referring to FIGS. 15, 17, and 18, a second opening 150A is formed at aregion spaced apart from the first opening 150 of the second body 151.The second region of the first and second lead frames 121 and 131correspond to the bottom of the second opening 150A. The first leadframe 121 is provided thereon with a protective device 163, and theprotective device 163 is connected to the second lead frame 131 througha third wire 168. The first and second bodies 141 and 151 serve asseparators between the first and second openings 150 and 150A. Thethickness of the first body 141 provided between the first and secondopenings 150 and 150A may be equal to the thickness of the protectivedevice 163 or may be thinner than or thicker than the thickness of theprotective device 163. The thickness of the first body 141 may be formedwith the thickness thicker than that of the protective device 163 bytaking light loss into consideration. The peripheral portion of thesecond opening 150A may be perpendicular to the top surfaces of the leadframes 121 and 131 or inclined with respect to the top surfaces of thelead frames 121 and 131. Although the protective device 163 is providedin the second opening 150A, the protective device 163 may be provided atanother region or may be omitted, but the embodiment is not limitedthereto. The protective device 163 may be realized by using a thyristor,a Zener diode, or a transient voltage suppression (TVS). The Zener diodeprotects the light emitting chip 161 from electro static discharge(ESD).

The transparent resin layer 171 is formed in the first opening 150 ofthe second body 151. The transparent resin layer 171 may include asilicon resin material or an epoxy resin material. In detail, thetransparent resin layer 171 may include a material representing at least70% of transmittance, in detail, at least 90% of transmittance withrespect to the wavelength (for example, blue wavelength) emitted fromthe light emitting chip 161.

The transparent resin layer 171 may have a flat top surface. Accordingto another embodiment, the transparent resin layer 171 may have aconcave top surface or a convex top surface.

The refractive index of the transparent resin layer 171 is 1.6 or less.The refractive index of the second body 151 may be equal to or lowerthan that of the transparent resin layer 171. In addition, therefractive index of the second body 151 may make the difference of about±0.2 from the refractive index of the transparent resin layer 171, butthe embodiment is not limited thereto.

The transparent resin layer 171 may include at least one of a filler, adiffusing agent, pigments, a phosphor material, and a reflectivematerial. The phosphor material contained in the transparent resin layer171 absorbs light emitted from the light emitting chip 161 towavelength-convert the light to light having a different wavelength. Thephosphorus material may include at least one of a yellow phosphor, agreen phosphor, a blue phosphor and a red phosphor. For instance, thephosphorus material may include at least one selected from the groupconsisting of a nitride based phosphor, an oxy-nitride based phosphorand a sialon based phosphor, which are mainly activated by lanthanoidbased elements, such as Eu or Ce; an alkali earth halogen apatitephosphor, which is mainly activated by a lanthanoid based element, suchas Eu, or a transient metallic element, such as Mn; an alkali earthmetal boric acid halogen phosphor; an alkali earth metal aluminatephosphor; an alkali earth silicate; an alkali earth sulfide; an alkaliearth thio-gallate; an alkali earth silicon nitride; a germinate; arare-earth aluminate mainly activated by a lanthanoid based element,such as Ce; a rare-earth silicate; and an organic chelating agent mainlyactivated by a lanthanoid based element, such as Eu, but the embodimentis not limited thereto.

As shown in FIG. 16, the optical lens 2 is provided on the transparentresin layer 171. The optical lens 2 may include a transparent resinmaterial such as silicon or epoxy, or a glass material. The optical lens2 may include a material representing a refractive index equal to orlower than the refractive index of the transparent resin layer 171. Theoptical lens 2 may be provided at the upper portion of the transparentresin layer 171 and the second body 151. An adhesive layer may be formedon the top surfaces of the first and second bodies 141 and 151 so thatthe top surfaces of the first and second bodies 141 and 151 adhere toeach other.

The second exit surface 23 of the optical lens 2 is formed outward ofthe outer surface S5 of the second body 151, and may make contact withthe top surface of the first body 141. The second exit surface 23 of theoptical lens 2 covers the peripheral portion of the second body 151 toclosely make contact with the outer surface of the second body 151,thereby adjusting the orientation angle of the second light L2 reflectedby the first body 141 or the first light L1 transmitted through thesecond body 151.

The peripheral portion of the optical lens 2 may have a circular shapefor the light distribution. When viewed from the top, the optical lens 2may have a circular shape or an oval shape.

The recess portion 24 may be formed at the central portion of the topsurface of the optical lens 2. The recess portion 24 corresponds to thelight emitting chip 161, and has a depth lower than the top surface ofthe optical lens 2 in the direction of the light emitting chip 161. Therecess portion 24 of the optical lens 2 totally reflects the lightreflected from the top surface of the first body 141. When viewed fromthe top, the recess portion 24 may have a circular shape, or may have ahemispherical lower portion or a conical lower portion.

Referring to FIGS. 17 and 18, a portion 183 of the optical lens 2 may befilled in the second opening 150A, or another resin member may be formedin the second opening 150A, but the embodiment is not limited thereto.

Referring to FIGS. 15 and 16, the light emitted from the light emittingchip 161 of the light emitting device 100 is emitted in all directions.In this case, a portion of light transmitted through the transparentresin layer 171 is transmitted through the second body 151, and aremaining portion of the light is incident into the optical lens 2through the top surface of the transparent resin layer 171. In addition,a portion of the light incident into the optical lens 2 is reflectedthrough the total-reflection surfaces of the recess portion 24. Thereflected light may be reflected by the top surface of the second body151 or may be reflected by the top surface of the first body 141 whenthe light is transmitted through the second body 151. Therefore,according to the light emitting device 100, light can be emittedsubstantially horizontally by the first body 141 provided lower than thetop surface of the light emitting chip 161. In addition, as shown inFIG. 22, as the angle θ5 is increased, the light orientation angle ismore increased. As the angle θ5 is reduced, the light orientation angleis more reduced. Accordingly, the light orientation angle can beadjusted according to the inclined surface or the thickness of the firstbody 141.

a. [Fabrication Method of Light Emitting Device]

As shown in FIGS. 19 and 20, the first body 141 is injection-molded onthe lead frames 121 and 131 through a molding scheme using a resinmaterial representing high reflectance. If the first body 141 is formedas shown in FIG. 21, the transparent second body 151 is injection-moldedthrough a transfer molding scheme, or an injection molding scheme usinga resin material representing high transmittance. In addition, as shownin FIGS. 15 and 16, the light emitting chip 161 and the protectivedevice 163 are mounted on the lead frames 121 and 131 exposed throughthe first opening 150 provided in the second body 151, and the lightemitting chip 161 is electrically connected to the lead frames 121 and131 by using wires 165, 166, and 168. In addition, the transparent resinlayer 171 is formed in the first opening 150 of the second body 151through a dispensing process or a molding scheme, and a phosphormaterial may be contained in the transparent resin layer 171. Theoptical lens 2 is coupled with the top surface of the transparent resinlayer 171. The optical lens 2 may be injection-molded through a transfermolding scheme or may be attached through an adhesive scheme. Anotherresin layer may be additionally formed between the transparent resinlayer 171 and the optical lens 2, but the embodiment is not limitedthereto. An adhesive layer may be formed on the top surfaces of thefirst and second bodies 131 and 141, but the embodiment is not limitedthereto.

FIG. 23 is a sectional view showing a light emitting device according tothe seventh embodiment. In the following description of the seventhembodiment, since the components and the structure the same as those ofthe sixth embodiment can be understood by making reference to the sixthembodiment, the details thereof will be omitted in order to avoidredundancy.

Referring to FIG. 23, a light emitting device includes the lead frames121 and 131, the first body 141, the second body 151, the firsttransparent resin layer 172, and a second transparent resin layer 173,and the optical lens 2.

The first transparent resin layer 172 may correspond to the transparentresin layer of FIG. 16, and may be contained therein with a phosphormaterial. The second transparent resin layer 173 is provided among thesecond body 151, the first transparent resin layer 172, and the opticallens 2.

The top surface of the second transparent resin layer 173 may beprovided horizontally to the top surface of the second body 151. In thiscase, the coupling force with the optical lens 2 attached onto thesecond transparent resin layer 173 can be improved.

At least one of the first and second transparent resin layers 172 and173 may include at least one of a filler, a diffusing agent, pigments, aphosphor material, and a reflective material. The phosphor material iscontained in the first transparent resin layer 172, and the secondtransparent resin layer 173 does not contain the phosphor material. Inaddition, the first and second transparent resin layers 172 and 173 mayinclude phosphor materials emitting different wavelengths, but theembodiment is not limited thereto.

A first adhesive layer 191 is formed between the first body 141 and thesecond body 151 to bond the first and second bodies 141 and 151, whichinclude different resin materials, to each other. A second adhesivelayer 192 may be formed between the second body 151 and the secondtransparent resin layer 173 to bond the second body 151 to the secondtransparent resin layer 173. A third adhesive layer 193 may be formed onthe top surface of the second transparent resin layer 173 to improve theadhesive strength between the second transparent resin layer 173 and theoptical lens 2.

The first to third adhesive layers 191, 192, and 193 include a resinmaterial such as silicon or epoxy to improve the adhesive strength. Thethicknesses of the first to third adhesive layers 191, 192, and 193 maybe formed in the range of 1 μm to 10 μm.

The first adhesive layer 191 may contain reflective metal or ascattering agent in order to improve the reflection efficiency. Thesecond and third adhesive layers 192 and 193 may contain a diffusingagent or a phosphor, but the embodiment is not limited thereto.

FIG. 24 is a side sectional view showing a light emitting deviceaccording to the eighth embodiment. In the following description of theeighth embodiment, since the components and the structure the same asthose of the sixth embodiment can be understood by making reference tothe sixth embodiment, the details thereof will be omitted in order toavoid redundancy.

Referring to FIG. 24, according to the light emitting device, the firstopening 150 in the body 151 is provided therein with a transparent resinlayer, for example, a phosphor layer 175. The phosphor layer 175 mayhave a hemispherical shape. The phosphor layer 175 may be providedaround the light emitting chip 161 while maintaining the substantiallyuniform distance from the center of the light emitting chip 161, so thatthe distribution of light having converted wavelengths can be uniformlyadjusted. The top surface of the phosphor layer 175 may protrude beyondthe top surface of the second body 151. The width of the bottom surfaceof the phosphor layer 175 may be wider than the width of the lightemitting chip 161, and may be narrower than the interval between thefirst and second wires 166 and 167.

The first opening 150 of the second body 151 may be filled with aportion 184 of the optical lens 2 or another resin member. The materialfilled in the first opening 150 may make contact with the phosphor layer175. The second body 151 having high transmittance is provided aroundthe light emitting chip 161, so that the first light emitted from thelight emitting chip 161 and the second light having a wavelengthconverted by the phosphor layer 175 are emitted with the lightorientation angle of 130° or more.

FIG. 25 is a side sectional view showing a light emitting deviceaccording to the ninth embodiment. In the following description of theninth embodiment, since the components and the structure the same asthose of the sixth embodiment can be understood by making reference tothe sixth embodiment, the details thereof will be omitted in order toavoid redundancy.

Referring to FIG. 25, according to the light emitting device, a stepstructure may be formed at an upper portion 154A of the second body 151having high transmittance. The thickness of the upper portion 154A ofthe second body 151 may be gradually reduced from an outer portion ofthe upper portion 154A to an inner portion of the upper portion 154A.The upper portion 154A of the second body 151 has the step structure, sothat the contact area between the upper portion 154A and the opticallens 2 can be increased, and the adhesive strength between the upperportion 154A and the optical lens 2 can be improved.

In addition, the thickness of the second body 151 is reduced from theinner portion thereof toward the outer portion thereof so that thesecond body 151 can support the optical lens 2 and the first body 141between the optical lens 2 and the first body 141 and can transmit thelight emitted from the light emitting chip 161.

FIG. 26 is a side sectional view showing a light emitting deviceaccording to the tenth embodiment. In the following description of thetenth embodiment, since the components and the structure the same asthose of the sixth embodiment can be understood by making reference tothe sixth embodiment, the details thereof will be omitted in order toavoid redundancy.

Referring to FIG. 26, the light emitting device may include the firstand second lead frames 121 and 131 having first to fourth concave-convexpatterns P1, P2, P3, and P4. The first and second concave-convexpatterns P1 and P2 are formed on the stepped bottom surface of the firstlead frame 121 and the stepped bottom surface of the second lead frame131 to increase the contact area with the first and second couplingparts 143 and 144. Accordingly, moisture can be prevented from beinginfiltrated into the space between the first body 141 and the leadframes 121 and 131.

In addition, the third and fourth concave-convex patterns P3 and P4 areformed on the bottom surface of the first end portion 124 of the firstlead frame 121 and the bottom surface of the second end portion 134 ofthe second lead frame 131, so that the contact area with the separationpart 142 can be increased. Accordingly, moisture can be prevented frombeing infiltrated into the space between the first body 141 and the leadframes 121 and 131.

According to another embodiment, another concave-convex pattern isadditionally formed on the top surfaces of the first and second leadframes 121 and 131, so that the contact between the first and secondlead frames 121 and 131 and the first body 141 can be enhanced, andmoisture infiltration can be prevented.

The fifth concave-convex pattern P6 is formed on the top surface of thefirst body 141 to increase the contact area between the outer sidewall23 of the optical lens 2, and the second body 151 and prevent moistureinfiltration.

An upper portion 154B of the second body 151 may be formed in a stepstructure having the height reduced from the outer portion of the upperportion 154B toward the inner portion of the upper portion 154B. Thetransparent resin layer 174 may be formed from the upper portion 154B ofthe second body 151 to the inner region of the second body 151, but theembodiment is not limited thereto.

FIG. 27 is a side sectional view showing a light emitting deviceaccording to the eleventh embodiment. In the following description ofthe eleventh embodiment, since the components and the structure the sameas those of the sixth embodiment can be understood by making referenceto the sixth embodiment, the details thereof will be omitted in order toavoid redundancy.

Referring to FIG. 27, the light emitting device includes a first leadframe 221, a second lead frame 231, a first body 241, a second body 251,a transparent resin layer 271, and the optical lens 2.

The first lead frame 221 includes a heat radiation part 222 having acavity 225, a first connection part 223, and a first lead part 224. Thefirst lead frame 221 may include at least one of a hole and a groove forthe purpose of coupling with the first body 241, but the embodiment isnot limited thereto. A light emitting chip 261 is provided on the bottomof the cavity 225 of the heat radiation part 222. The lateral side ofthe cavity 225 is perpendicular to the bottom surface of the first body241 or inclined at an angle of 90° or more with respect to the bottomsurface of the first body 241 to reflect the light from the lightemitting chip 261. The heat radiation part 222 may radiate the heatemitted from the light emitting chip 261 through a substrate or a heatradiation plate provided at the lower portion thereof.

The second lead frame 231 includes a second connection part 233 and asecond lead part 234. The second lead frame 231 may include a hole 235,and a portion of the first body 241 may be provided in the hole 235. Thefirst connection part 223 of the first lead frame 221 and the secondconnection part 233 of the second lead frame 231 are exposed through thefirst opening 250 of the second body 251. A cavity 255 is provided atthe central portion of the first opening 250.

The first connection part 223 of the first lead frame 221 and the secondconnection part 233 of the second lead frame 231 are exposed through thetop surface of the first body 241. The light emitting chip 261 may beconnected to the first connection part 223 through a first wire 266, andmay be connected to the second connection part 233 through a second wire267.

The first lead part 224 of the first lead frame 221 may be bent from thefirst connection part 223 and exposed to the bottom surface of the firstbody 241 through the first body 241. The first lead part 224 mayprotrude beyond the second lateral side S12 of the first body 241.

The second lead part 234 of the second lead frame 231 is bent from thesecond connection part 233 and exposed to the bottom surface of thefirst body 241 in the first body 241. A portion of the second lead part234 may protrude beyond the first lateral side S11 of the first body241.

An outer portion of the top surface 244 of the first body 241 may beinclined, and the internal angle of the outer portion of the top surface244 may be formed in the range of 140° to 170°.

A second body 251 representing high transmittance is provided at aperipheral portion of the top surface of the first body 241. The secondbody 251 transmits the light incident thereto to widen the lightorientation angle. An inner lateral side 252 of the second body 251 maybe inclined, but the embodiment is not limited thereto.

A transparent resin layer 271 is formed in the cavity 255. Thetransparent resin layer 271 may include a resin material such as siliconor epoxy. The transparent resin layer 271 may include at least one of afiller, a diffusing agent, pigments, a phosphor material, and areflective material.

An upper portion 253 of the second body 251 has a step structure, andthe step structure may be coupled with the outer sidewall 23 of theoptical lens 2. The optical lens 2 is provided at the central portionthereof with the recess portion 24. The bottom surface of the opticallens 2 may make contact with the top surface of the transparent resinlayer 271, or may be spaced apart from the top surface of thetransparent resin layer 271. In addition, another resin layer may beadditionally provided between the optical lens 2 and the transparentresin layer 271, but the embodiment is not limited thereto.

Wires 266 and 267 are provided in the first opening 250 of the secondbody 251, or another resin layer may be formed in the first opening 250.The outer lateral side S15 of the second body 251 may be formed in linewith the outer lateral sides S11 and S12 of the first body 241, but theembodiment is not limited thereto.

FIG. 28 is a side sectional view showing a light emitting deviceaccording to the twelfth embodiment. In the following description of thetwelfth embodiment, since the components and the structure the same asthose of the sixth embodiment can be understood by making reference tothe sixth embodiment, the details thereof will be omitted in order toavoid redundancy.

Referring to FIG. 28, the light emitting device includes first andsecond lead frames 321 and 331, a third lead frame 325 between the firstand second lead frames 321 and 331, a transparent resin layer 371 on thethird lead frame 325, a first body 341 to support the first to thirdlead frames 321, 331, and 325, a second body 351 provided on the firstbody 341 and representing transmittance higher than that of the firstbody 341, and the optical lens 2 on the transparent resin layer 371.

The first lead frame 321 is interposed between a first lateral side S11of the first body 341 and the third lead frame 325, and includes a firstconnection part 322 and a first lead part 323. The first connection part322 is exposed to the top surface of the first body 341 and connected toa light emitting chip 361 through a first wire 366. The first lead part323 is bent or extends from the first connection part 322 in the firstbody 341 and provided on the bottom surface of the first body 341 whileprotruding in the direction of the first lateral side S11 of the firstbody 341.

The second lead frame 331 is interposed between a second lateral sideS12 of the first body 341 and the third lead frame 325, and includes asecond connection part 332 and a second lead part 333. The secondconnection part 332 is exposed to the top surface of the first body 341and connected to the light emitting chip 361 through a second wire 367.The second lead part 333 is bent in the first body 341 and extends tothe bottom surface of the first body 341 while protruding in thedirection of the second lateral side S12 of the first body 341.

The third lead frame 325 includes a heat radiation part 326 having acavity 320 and a support part 327 bent from the heat radiation part 326.The light emitting chip 361 is provided on the bottom of the cavity 320.The bottom surface of the heat radiation part 326 may be exposed to thebottom surface of the first body 341. The support part 327 may beexposed to the top surface of the first body 341, but the embodiment isnot limited thereto. The heat radiation part 326 may radiate heatemitted from the light emitting chip 361 through a substrate or a heatradiation plate provided at the lower portion of the heat radiation part326.

The first body 341 includes a first separation part 342 between thefirst and third lead frames 321 and 331, and a second separation part343 between the third and second lead frames 325 and 331.

The first connection part 322 of the first lead frame 321 and the secondconnection part 332 of the second lead frame 331 are exposed through afirst opening 350 of the second body 351. A cavity 320 is provided atthe central portion of the first opening 350 of the second body 351.

The light emitting chip 36 is provided on the bottom of the cavity 320.The light emitting chip 361 is connected with the first connection part322 of the first lead frame 321 through the first wire 366, andconnected with the second connection part 332 of the second lead frame321 through the second wire 367.

The transparent support layer 371 is formed in the cavity 320. Thetransparent support layer 371 may be formed horizontally to the topsurface of the first body 341, but the embodiment is not limitedthereto. The transparent resin layer 371 may include a resin materialsuch as silicon or epoxy. The transparent resin layer 371 may include atleast one of a filler, a diffusing agent, pigments, a phosphor material,and a reflective material.

The first body 341 corresponds to the first body according to the fifthembodiment. The outer portion of the top surface 344 may be inclined.The internal angle of the inclined surface of the first body 341 may beformed in the range of 135° to 180°.

The second body 351 corresponds to the second body according to thefifth embodiment. The first opening 350 formed in the second body 351may have a width wider than that of the top surface of the cavity 320,but the embodiment is not limited thereto.

The top surface of the light emitting chip 361 may be lower than the topsurface of the first body 341, but the embodiment is not limitedthereto. The light emitted from the light emitting chip 361 may bereflected by the recess portion 24 of the optical lens 2, and thereflected light may be reflected by the top surface and the inclinedsurface of the first body 341. The light incident into the second body351 is transmitted, so that the light orientation angle can be widened.

The outer sidewall 23 of the optical lens 2 may be provided inward ofthe lateral side S15 of the second body 351, but the embodiment is notlimited thereto.

According to another embodiment, the top surface of the light emittingchip 361 may be exposed to the top surface of the first body 341. Inthis case, the light emitted from the light emitting chip 361 isreflected by the top surface and the inclined surface of the first body341, or transmitted through the second body 351. Accordingly, theorientation angle of the light can be more widened. The depth of thecavity 320 may vary depending on the bending degree of the heatradiation part 326 of the third lead frame 325, and may be adjusted.

FIG. 29 is a sectional view showing a light emitting device according tothe thirteenth embodiment. In the following description of thethirteenth embodiment, since the components and the structure the sameas those of the sixth embodiment can be understood by making referenceto the sixth embodiment, the details thereof will be omitted in order toavoid redundancy.

Referring to FIG. 29, the light emitting chip 1 is spaced apart from arecess part 66 provided in a light incident surface 61 of an opticallens 6 while being provided horizontally to the light incident surface61. The recess part 66 has a hemispherical shape which is convexlyrecessed in the direction of the recess part 64. The structure of theoptical lens 6 includes a recess portion 64, a convex portion 65, andexit surfaces 62 and 63, and the details thereof will be understood bymaking reference to the structure according to the second to fourthembodiments. The recess part 66 diffuses light emitted from the lightemitting chip 1 to allow the light to be incident into the optical lens6. The optical lens 6 reflects the incident light in a lateral directionby total-reflection surfaces 64A, 64B, and 64C of the recess portion 64to improve the light orientation angle. The light emitting chip 1 may beprovided in the recess part 66 provided upward of the incident surface61 of the optical lens 6, but the embodiment is not limited thereto.

FIG. 30 is a side sectional view showing one example of the lightemitting chip according to the embodiment.

Referring to FIG. 30, the light emitting chip includes a substrate 311,a buffer layer 312, a light emitting structure 310, a first electrode316, and a second electrode 317. The substrate 311 may include asubstrate including a transmissive material or a non-transmissivematerial, and may include a conductive substrate or an insulatingsubstrate.

The buffer layer 312 reduces the lattice constant difference between thematerials constituting the substrate 311 and the light emittingstructure 310, and may include a nitride semiconductor. A nitridesemiconductor layer, which is not doped with dopants, is furtherdisposed between the buffer layer 312 and the light emitting structure310, so that the crystal quality can be improved.

The light emitting structure 310 includes a first conductivesemiconductor layer 313, an active layer 314, and a second conductivesemiconductor layer 315.

The first conductive semiconductor layer 313 may include the group III-Vcompound semiconductor doped with the first conductive dopant. Forexample, the first conductive semiconductor layer 313 may include thesemiconductor material having the compositional formula ofInxAlyGa1-x-yN (0≦x≦1, 0≦y≦1, 0≦x+y≦1). In detail, the first conductivesemiconductor layer 313 may include the stack structure of layersincluding one selected from the group consisting of GaN, InN, AlN,InGaN, AlGaN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, and AlGaInP. Ifthe first conductive semiconductor layer 313 is an n type semiconductorlayer, the first conductive dopant includes the n type dopant such asSi, Ge, Sn, Se, or Te.

A first clad layer may be formed between the first conductivesemiconductor layer 313 and the active layer 314. The first clad layermay include a GaN-based semiconductor, and the bandgap of the first cladlayer may be equal to or greater than the bandgap of the active layer314. The first clad layer has the first conductive type, and confinescarriers.

The active layer 314 is disposed on the first conductive semiconductorlayer 313, and includes a single quantum well structure, a multiplequantum well (MQW) structure, a quantum wire structure or a quantum dotstructure. The active layer 314 has the cycle of the well and barrierlayers. The well layer may have the composition formula ofInxAlyGa1-x-yN (0≦x≦1, 0≦y≦1, 0≦x+y≦1), and the barrier layer may havethe composition formula of InxAlyGa1-x-yN (0≦x≦1, 0≦y≦1, 0≦x+y≦1). Atleast one cycle of the well/barrier layers may be used through the stackstructure of InGaN/GaN, GaN/AlGaN, InGaN/AlGaN, InGaN/InGaN,InAlGaN/AlGaN and InAlGaN/InAlGaN. The barrier layer may include asemiconductor material having the bandgap higher than the bandgap of thewell layer.

The second conductive layer 315 is formed on the active layer 314. Thesecond conductive layer 315 includes a semiconductor doped with secondconductive dopants, for example, includes a semiconductor having thecomposition formula of InxAlyGa1-x-yN (0≦x≦1, 0≦y≦1, 0≦x+y≦1). Indetail, the second conductive semiconductor layer 315 may include oneselected from compound semiconductors such as GaN, InN, AlN, InGaN,AlGaN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, and AlGaInP. If thesecond conductive semiconductor layer 315 is a p type semiconductorlayer, the semiconductor conductive dopant includes the p type dopantsuch as Mg, Zn, Ca, Sr, or Ba.

The second conductive semiconductor layer 315 may include a superlatticestructure, and the superlattice structure may include an InGaN/GaNsuperlattice structure or am AlGaN/GaN superlattice structure. Thesuperlattice structure of the second conductive semiconductor layer 315abnormally spreads the current, thereby protecting the active layer 314.

In addition, the light emitting structure 310 may have an oppositeconductive type. For example, the first conductive semiconductor layer313 may include a P type semiconductor layer, and the second conductivesemiconductor layer 315 may include an N type semiconductor layer. Thesecond conductive semiconductor layer 315 may be disposed thereon with afirst conductive semiconductor layer having the polarity opposite to thesecond conductive type polarity.

The light emitting structure 310 may be realized by using one of an n-pjunction structure, a p-n junction structure, an n-p-n junctionstructure, and a p-n-p junction structure. The “p” represents a p typesemiconductor, the “n” represents an n type semiconductor layer, and the“-” represents that the p type semiconductor is directly or indirectlyconnected to the n type semiconductor. Hereinafter, a case that theuppermost layer of the light emitting structure 310 is the secondconductive semiconductor layer 315 will be described for the convenienceof explanation.

The first electrode 316 is disposed on the first conductivesemiconductor layer 313, and the second electrode 317 having a currentspreading layer is disposed on the second conductive semiconductor layer315. The first and second electrodes 316 and 317 are connected to eachother through a wire, or through another connection scheme.

FIG. 31 is a graph showing another example of the light emitting chipaccording to the embodiment. Hereinafter, in the following descriptionof the embodiment, the details of the same parts as that of FIG. 30 willbe omitted except for brief description.

Referring to FIG. 31, in a light emitting chip according to theembodiment, a contact layer 321 is formed under a light emittingstructure 310, a reflective layer 324 is formed under the contact layer321, a support member 325 is formed under the reflective layer 324, anda protective layer 323 may be formed around the reflective layer 324 andthe light emitting structure 310.

One or a plurality of first electrodes 316 may be formed on the lightemitting structure 310, and the first electrode 316 includes a padbonded to a wire.

The light emitting chip may be formed by removing a growth substrateafter forming a contact layer 321, a protective layer 323, a reflectivelayer 324, and a support member 323 under the second conductivesemiconductor layer 315.

The contact layer 321 may make ohmic-contact with a lower layer of thelight emitting structure 310, for example, the second conductivesemiconductor layer 315, and may include a metallic oxide, a metallicnitride, an insulating material, or a conductive material. For example,the contact layer 321 may include ITO (indium tin oxide), IZO (indiumzinc oxide), IZTO (indium zinc tin oxide), IAZO (indium aluminum zincoxide), IGZO (indium gallium zinc oxide), IGTO (indium gallium tinoxide), AZO (aluminum zinc oxide), ATO (antimony tin oxide), GZO(gallium zinc oxide), Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, Hf,and the selective combination thereof. The contact layer 321 may beformed in a multi-layer structure by using a metallic material and atransparent material such as IZO, IZTO, IAZO, IGZO, IGTO, AZO, or ATO.For example, the contact layer 321 may have the stack structure ofIZO/Ni, AZO/Ag, IZO/Ag/Ni, or AZO/Ag/Ni. A layer to block current may befurther formed in the contact layer 321 corresponding to the electrode316.

The protective layer 323 may include a metallic oxide or an insulatingmaterial. For example, the protective layer 323 may selectively includeITO (indium tin oxide), IZO (indium zinc oxide), IZTO (indium zinc tinoxide), IAZO (indium aluminum zinc oxide), IGZO (indium gallium zincoxide), IGTO (indium gallium tin oxide), AZO (aluminum zinc oxide), ATO(antimony tin oxide), GZO (gallium zinc oxide), SiO2, SiOx, SiOxNy,Si3N4, Al2O3, or TiO2. The protective layer 323 may be formed through asputtering scheme or a deposition scheme. The metal constituting thereflective layer 324 may prevent the layers of the light emittingstructure 310 from being shorted.

The reflective layer 324 may include metal such as Ag, Ni, Al, Rh, Pd,Ir, Ru, Mg, Zn, Pt, Au, Hf, or the selective combination thereof. Thereflective layer 324 may have a width greater than the width of thelight emitting structure 310, thereby improving the light reflectionefficiency. A metallic layer for bonding and a metallic layer forthermal diffusion may be further disposed between the reflective layer324 and the support member 325, but the embodiment is not limitedthereto.

The support member 325 serves as a base substrate, and may include metalsuch as Cu, Au, Ni, Mo, or Cu—W, and a carrier wafer, such as Si, Ge,GaAs, ZnO, and SiC. An adhesive layer may be further formed between thesupport member 325 and the reflective layer 324, and bonds the twolayers to each other. The disclosed light emitting chip is four theillustrative purpose, and the embodiment is not limited thereto. Thelight emitting chip may be selective applied to the light emittingdevice according to the embodiment, but the embodiment is not limitedthereto.

<Lighting System>

The light emitting device according to the embodiment is applicable to alighting system. The lighting system includes a structure in which aplurality of light emitting devices are arrayed. The lighting systemincludes a display apparatus shown in FIGS. 31 and 32, a lightingapparatus shown in FIG. 33, a lighting lamp, a camera flash, a signallamp, a headlamp for a vehicle, and an electronic display.

FIG. 32 is an exploded perspective view showing a display apparatushaving the light emitting device according to the embodiment.

Referring to FIG. 32, a display apparatus 1000 according to theembodiment includes a light guide plate 1041, a light source module 1033to supply light to the light guide plate 1041, a reflective member 1022under the light guide plate 1041, an optical sheet 1051 on the lightguide plate 1041, a display panel 1061 on the optical sheet 1051, and abottom cover 1011 to receive the light guide plate 1041, the lightsource module 1033, and the reflective member 1022, but the embodimentis not limited thereto.

The bottom cover 1011, the reflective sheet 1022, the light guide plate1041, the optical sheet 1051, and the light unit 1050 may be defined asa backlight unit.

The light guide plate 1041 diffuses the light supplied from the lightsource module 1033 to provide surface light. The light guide plate 1041may include a transparent material. For example, the light guide plate1041 may include one of acryl-based resin, such as PMMA (polymethylmethacrylate, PET (polyethylene terephthalate), PC (polycarbonate), COC(cyclic olefin copolymer) and PEN (polyethylene naphthalate) resin.

The light source module 1033 is disposed on at least one side of thelight guide plate 1041 to supply the light to at least one side of thelight guide plate 1041. The light source module 1033 serves as the lightsource of the display device.

At least one light source module 1033 is disposed to directly orindirectly supply the light from one side of the light guide plate 1041.The light source module 1033 may include a board 1031 and the lightemitting device according to the embodiments or the light emittingdevice 1035. The light emitting device or the light emitting device 1035are arranged on the board 1031 while being spaced apart from each otherat the predetermined interval.

The board 1031 may include a printed circuit board (PCB) including acircuit pattern (not shown). In addition, the board 1031 may alsoinclude a metal core PCB (MCPCB) or a flexible PCB (FPCB) as well as atypical PCB, but the embodiment is not limited thereto. If the lightemitting device 1035 is installed on the side of the bottom cover 1011or on a heat dissipation plate, the board 1031 may be omitted. The heatdissipation plate partially makes contact with the top surface of thebottom cover 1011.

In addition, the light emitting device 1035 are arranged such that lightexit surfaces to discharge light of the light emitting device 1035 arespaced apart from the light guide plate 1041 by a predetermined distanceon the board 1031, but the embodiment is not limited thereto. The lightemitting device 1035 may directly or indirectly supply the light to alight incident surface, which is one side of the light guide plate 1041,but the embodiment is not limited thereto.

The reflective member 1022 is disposed below the light guide plate 1041.The reflective member 1022 reflects the light, which is traveleddownward through the bottom surface of the light guide plate 1041,toward the display panel 1061, thereby improving the brightness of thelight unit 1050. For example, the reflective member 1022 may includePET, PC or PVC resin, but the embodiment is not limited thereto. Thereflective member 1022 may serve as the top surface of the bottom cover1011, but the embodiment is not limited thereto.

The bottom cover 1011 may receive the light guide plate 1041, the lightsource module 1033, and the reflective member 1022 therein. To this end,the bottom cover 1011 has a receiving section 1012 having a box shapewith an opened top surface, but the embodiment is not limited thereto.The bottom cover 1011 can be coupled with the top cover (not shown), butthe embodiment is not limited thereto.

The bottom cover 1011 can be manufactured through a press process or anextrusion process by using metallic material or resin material. Inaddition, the bottom cover 1011 may include metal or non-metallicmaterial having superior thermal conductivity, but the embodiment is notlimited thereto.

The display panel 1061, for example, is an LCD panel including first andsecond transparent substrates, which are opposite to each other, and aliquid crystal layer interposed between the first and second substrates.A polarizing plate can be attached to at least one surface of thedisplay panel 1061, but the embodiment is not limited thereto. Thedisplay panel 1061 displays information by allowing the light to passtherethrough. The display device 1000 can be applied to various portableterminals, monitors of notebook computers, monitors or laptop computers,and televisions.

The optical sheet 1051 is disposed between the display panel 1061 andthe light guide plate 1041 and includes at least one transmissive sheet.For example, the optical sheet 1051 includes at least one selected fromthe group consisting of a diffusion sheet, a horizontal and verticalprism sheet, and a brightness enhanced sheet. The diffusion sheetdiffuses the incident light, the horizontal and vertical prism sheetconcentrates the incident light onto the display panel 1061, and thebrightness enhanced sheet improves the brightness by reusing the lostlight. In addition, a protective sheet can be disposed on the displaypanel 1061, but the embodiment is not limited thereto.

The light guide plate 1041 and the optical sheet 1051 can be disposed inthe light path of the light source module 103 as optical members, butthe embodiment is not limited thereto.

FIG. 33 is a sectional view showing a display apparatus according to theembodiment.

Referring to FIG. 33, the display device 1100 includes a bottom cover1152, a board 1120 on which the light emitting device 1124 are arrayed,an optical member 1154, and a display panel 1155.

The board 1120 and the light emitting device 1124 may constitute thelight source module 1160. In addition, the bottom cover 1152, at leastone light source module 1160, and the optical member 1154 may constitutethe light unit 1150. The bottom cover 1151 can be disposed with areceiving section 1153, but the embodiment is not limited thereto. Thelight source module 1160 includes a board 1120, and a plurality of lightemitting devices arranged on the board 1120 or a light emitting device1124.

The optical member 1154 may include at least one selected from the groupconsisting of a lens, a light guide plate, a diffusion sheet, ahorizontal and vertical prism sheet, and a brightness enhanced sheet.The light guide plate may include PC or PMMA (Poly methyl methacrylate).The light guide plate can be omitted. The diffusion sheet diffuses theincident light, the horizontal and vertical prism sheet concentrates theincident light onto a display region, and the brightness enhanced sheetimproves the brightness by reusing the lost light.

The optical member 1154 is disposed above the light source module 1160in order to convert the light emitted from the light source module 1160into the surface light.

FIG. 34 is an exploded perspective view showing a lighting device havingthe light emitting device according to the embodiment.

Referring to FIG. 34, the lighting device according to the embodimentmay include a cover 2100, a light source module 2200, a heat radiationmember 2400, a power supply part 2600, an inner case 2700, and a socket2800. In addition, the light emitting device according to the embodimentmay further include at least one of a member 2300 and a holder 2500. Thelight source module 2200 may include the light emitting device accordingto the embodiment.

For example, the cover 2100 has the shape of a bulb, or a hemisphericalshape. The cover 2100 may have a hollow structure, and a portion of thecover 2100 may be open. The cover 2100 may be optically connected to thelight source module 2200, and may be coupled with the heat radiationmember 2400. The cover 2100 may have a recess part coupled with the heatradiation member 2400.

The inner surface of the cover 2100 may be coated with ivory whitepigments serving as a diffusing agent. The light emitted from the lightsource module 2200 may be scattered or diffused by using the ivory whitematerial, so that the light can be discharged to the outside.

The cover 2100 may include glass, plastic, PP, PE, or PC. In this case,the PC represents superior light resistance, superior heat resistance,and superior strength. The cover 2100 may be transparent so that thelight source module 2200 may be recognized at the outside. In addition,the cover 2100 may be opaque. The cover 2100 may be formed through ablow molding scheme.

The light source module 2200 may be disposed at one surface of the heatradiation member 2400. Accordingly, the heat emitted from the lightsource module 2200 is conducted to the heat radiation member 2400. Thelight source module 2200 may include a light emitting device 2210, aconnection plate 2230, and a connector 2250.

The member 2300 is disposed on the top surface of the heat radiationmember 2400, and has a guide groove 2310 having a plurality of lightemitting devices 2210 and a connector 2250 inserted into the guidegroove 2310. The guide groove 2310 corresponds to the substrate of thelight emitting device 2210 and the connector 2250.

White pigments may be applied to or coated on the surface of the member2300. The member 2300 reflects light, which reflected by the innersurface of the cover 2100 to return to the light source module 2200,toward the cover 2100. Accordingly, the light efficiency of the lightingapparatus according to the embodiment can be improved.

The member 2300 may include an insulating material. The connection plate2230 of the light source module 2200 may include an electric-conductivematerial. Accordingly, the heat radiation member 2400 may beelectrically connected to the connection plate 2230. The member 2300includes an insulating material to prevent the electrical short betweenthe connection plate 2230 and the heat radiation member 2400. The heatradiation member 2400 receives heat from the light source module 2200and the heat from the power supply part 2600 and radiates the heats.

The holder 2500 blocks a receiving groove 2719 of an insulating part2710 disposed in an internal case 2700. Accordingly, the power supplypart 2600 received in the insulating part 2710 of the internal case 2700is sealed. The holder 2500 has a guide protrusion part 2510. The guideprotrusion part 2510 may include a hole allowing a protrusion part 2610of the power supply part 2600 to pass therethrough.

The power supply part 2600 processes and transforms an electrical signalreceived from the outside and supplies the electrical signal to thelight source module 2200. The power supply part 2600 is received in thereceiving groove 2719 of the internal case 2700, and sealed in theinternal case 2700 by the holder 2500.

The power supply part 2600 may include a protrusion part 2610, a guidepart 2630, a base 2650, and an extension part 2670.

The guide part 2630 protrudes outward from one side of the base 2650.The guide part 2630 may be inserted into the holder 2500. A plurality ofparts may be disposed on one surface of the base 2650. For example, theparts include a DC converter, a driving chip to drive the light sourcemodule 2220, and an ESD (electrostatic discharge) protective device toprotect the light source module 2200, but the embodiment is not limitedthereto.

The extension part 2670 protrudes outward from another side of the base2650. The extension part 2670 is inserted into the connection part 2750of the internal case 2700, and receives an electrical signal from theoutside. For example, the extension part 2670 may be equal to or lessthan the width of the connection part 2750 of the internal case 2700.The extension part 2670 may be electrically connected to the socket 2800through a wire.

The internal case 2700 may be disposed therein with a molding parttogether with the power supply part 2600. The molding part is formed byhardening a molding liquid, so that the power supply part 2600 may befixed into the internal case 2700.

The embodiment can provide an optical lens having a wide lightorientation angle. The orientation angle of the light emitted from alight emitting chip can be widened by using the optical lens. Theembodiment can provide a dam structure capable of preventing areflective member, which is filled in the recess portion of the opticallens, from being provided beyond the recess portion. Accordingly,foreign matters can be prevented from being produced on the exit surfaceof the optical lens. According to the embodiment, the product yield ofthe optical lens can be improved, so that the optical reliability of theoptical lens can be improved.

According to the embodiment, the reliability of the light emittingdevice and the lighting device having the same can be improved.

According to the embodiment, the distribution of the light orientationangle of the light emitting device having the optical lens can beimproved. According to the embodiment, the optical lens is applicable toa lighting lamp, a signal lamp, the headlamp of a vehicle, and anelectronic display having a light emitting device mounted thereon.According to the embodiment, the reliability of the light emittingdevice having the optical lens and a lighting device having the lightemitting device can be improved. The embodiment can provide an opticallens having a dam for a reflective member to reflect light in a lightexit region.

Any reference in this specification to “one embodiment,” “anembodiment,” “example embodiment,” etc., means that a particularfeature, structure, or characteristic described in connection with theembodiment is included in at least one embodiment of the invention. Theappearances of such phrases in various places in the specification arenot necessarily all referring to the same embodiment. Further, when aparticular feature, structure, or characteristic is described inconnection with any embodiment, it is submitted that it is within thepurview of one skilled in the art to effect such feature, structure, orcharacteristic in connection with other ones of the embodiments.

Although embodiments have been described with reference to a number ofillustrative embodiments thereof, it should be understood that numerousother modifications and embodiments can be devised by those skilled inthe art that will fall within the spirit and scope of the principles ofthis disclosure. More particularly, various variations and modificationsare possible in the component parts and/or arrangements of the subjectcombination arrangement within the scope of the disclosure, the drawingsand the appended claims. In addition to variations and modifications inthe component parts and/or arrangements, alternative uses will also beapparent to those skilled in the art.

What is claimed is:
 1. A light emitting device comprising: a lightemitting chip; and an optical lens over the light emitting chip, whereinthe optical lens comprises: an incident surface into which a lightemitted from the light emitting chip is incident; a recess portionopposite to the incident surface and recessed in a direction of theincident surface; an exit surface provided at a peripheral part of therecess portion to output a light incident through the incident surface;and a convex portion protruding between the recess portion and the exitsurface and connected with at least one of the recess portion and theexit surface through an inflection point, and wherein the convex portionis located inward of a line segment ranging from the light emitting chipto a first inflection point provided at an outermost portion of therecess portion.
 2. The light emitting device of claim 1, furthercomprising a reflective member on the recess portion.
 3. The lightemitting device of claim 2, wherein a top surface of the reflectivemember has a position lower than a position of an apex of the opticallens, and higher than a position of the first inflection point providedat the outermost portion of the recess portion.
 4. The light emittingdevice of claim 2, wherein a top surface of the reflective member has alength shorter than a diameter between apexes of the optical lens andlonger than a diameter between first inflection points.
 5. The lightemitting device of claim 2, wherein a first angle between a tangentialline, which passes through the first inflection point from the lightemitting chip, and an optical axis is smaller than a second anglebetween a tangential line extending from the light emitting chip andmaking contact with an outermost curved surface of the recess portionand the optical axis, and the first inflection point is closest to therecess portion from the apex.
 6. The light emitting device of claim 5,wherein the first angle is smaller than an angle between a tangentialline extending from the light emitting chip and making contact with aninnermost curved surface of the convex portion and the optical axis. 7.The light emitting device of claim 6, wherein the first angle is in arange of 40° to 60°.
 8. The light emitting device of claim 6, wherein adistance between the optical axis and the first inflection point is in arange of 59% to 65% based on a radius of the optical lens.
 9. The lightemitting device of claim 2, wherein the recess portion comprises a firsttotal-reflection surface close to the light emitting chip and having afirst curvature, a second total-reflection surface connected with thefirst total-reflection surface and having a second curvature, and athird total-reflection surface connected with the secondtotal-reflection surface and having a third curvature, and the convexportion has a curvature smaller than the first and second curvatures.10. The light emitting device of claim 9, wherein the secondtotal-reflection surface comprises a plurality of curved surfaces havingcurvatures different from each other between the first and thirdtotal-reflection surfaces.
 11. The light emitting device of claim 2,wherein the light emitting chip is spaced apart from the incidentsurface of the optical lens.
 12. The light emitting device of claim 11,wherein the incident surface of the optical lens comprises a flatsurface or a recess part convexly recessed in a direction of the recessportion.
 13. The light emitting device of claim 2, wherein the convexportion is disposed inward of an apex of the optical lens and an apex ofthe exit surface.
 14. The light emitting device of claim 2, furthercomprising: a first body provided at a peripheral portion of the lightemitting chip and formed of a reflective material; a second bodyincluding a transparent material on the first body; a resin layer tocover the light emitting chip; and a plurality of lead frames coupledwith the first body and the resin layer and electrically connected tothe light emitting chip.
 15. The light emitting device of claim 2,wherein the convex portion protrudes beyond an apex of the exit surface.16. The light emitting device of claim 2, wherein the convex portioncomprises an inner region making contact with the reflective member andan outer region spaced apart from the reflective member.
 17. The lightemitting device of claim 2, wherein the reflective member makes contactwith the convex portion and the recess portion.
 18. The light emittingdevice of claim 2, wherein the convex portion and the recess portion arerotational-symmetric to each other about the optical axis.
 19. The lightemitting device of claim 2, wherein the convex portion is provided in aring shape at the peripheral portion of the recess portion.
 20. Thelight emitting device of claim 2, wherein the recess portion has a depthin a range of 65% to 75% based on a thickness of the optical lens.